DRAM封装型号_DRAM厂家价格-bom2buy

Parts

Parts						Most Relevant								Technical																			Compliance			Operating Conditions					Physical											Dimensions			Other
Parts	Datasheet	Price/Stock	Risk Rank	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	mfrid	Package Description	Reach Compliance Code	Country Of Origin	ECCN Code	HTS Code	YTEOL	Part Package Code	Pin Count
AS4C4M16SA-6TIN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	INDUSTRIAL	R-PDSO-G54			3	85 °C	-40 °C			54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C4M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54			3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C16M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	143 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS		YES	1,2,4,8,FP	20 mA	3 V	55 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.24	4
AS4C8M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	134.2177 Mbit	16	8MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	8000000	8.3886 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C16M16SA-7TCNTR Alliance Memory Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	143 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS		YES	1,2,4,8,FP	20 mA		55 µA	3.6 V	3 V	CMOS		R-PDSO-G54			3	70 °C				54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.24	4
MT47H128M16RT-25E:C Micron Technology Inc		Query price and inventory		Yes	Yes	Active	2.1475 Gbit	16	128MX16	1.8 V	400 ps	400 MHz	8192	MULTI BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	4,8	12 mA		330 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84	Not Qualified	e1		85 °C		260	30	84	PLASTIC/EPOXY	TFBGA	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	9 mm	2190	9 X 12.50 MM, ROHS COMPLIANT, FBGA-84	compliant		EAR99	8542.32.00.36	4.75	BGA	84
MT48LC8M16A2P-6A:L Micron Technology Inc		Query price and inventory			Yes	Active	134.2177 Mbit	16	8MX16	3.3 V	5.4 ns	167 MHz	4096	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	8000000	8.3886 M	SYNCHRONOUS	3-STATE	YES	1,2,4,8,FP	2.5 mA		100 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54	Not Qualified	e3		70 °C		260	30	54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	MATTE TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2190	0.400 INCH, LEAD FREE, PLASTIC, TSOP2-54	compliant		EAR99	8542.32.00.02	4	TSOP2	54
MT41K64M16TW-107:J Micron Technology Inc		Query price and inventory			Yes	Active	1.0737 Gbit	16	64MX16	1.35 V		933 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM		COMMON	8	1	1	64000000	67.1089 M	SYNCHRONOUS	3-STATE	YES	8	28 mA		219 µA	1.45 V	1.283 V	CMOS		R-PBGA-B96	Not Qualified	e1		95 °C		NOT SPECIFIED	NOT SPECIFIED	96	PLASTIC/EPOXY	TFBGA	BGA96,6X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190	8 X 14 MM, LEAD FREE, FBGA-96	compliant		EAR99	8542.32.00.32	5.07
AS4C32M16D2A-25BCN Alliance Memory Inc		Query price and inventory			Yes	Active	536.8709 Mbit	16	32MX16	1.8 V	400 ps			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	32000000	33.5544 M	SYNCHRONOUS		YES					1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84			3	85 °C				84	PLASTIC/EPOXY	TFBGA		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES		BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	8 mm	1689	FBGA-84	compliant	Taiwan	EAR99	8542.32.00.28	4
MT41K256M16TW-107:P Micron Technology Inc		Query price and inventory			Yes	Active	4.295 Gbit	16	256MX16	1.35 V	195 ps	933 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM		COMMON	8	1	1	256000000	268.4355 M	SYNCHRONOUS	3-STATE	YES	8				1.45 V	1.283 V	CMOS	OTHER	R-PBGA-B96				95 °C		260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190	FBGA-96	not_compliant		EAR99	8542.32.00.36	5.15
IS43TR16256BL-107MBLI Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	4.295 Gbit	16	256MX16	1.35 V			8192	MULTI BANK PAGE BURST	DDR3 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	256000000	268.4355 M	SYNCHRONOUS	3-STATE	YES	4,8				1.45 V	1.283 V	CMOS	INDUSTRIAL	R-PBGA-B96		e1	3	95 °C	-40 °C	260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	13 mm	9 mm	2070	FBGA-96	compliant	Mainland China, Taiwan	EAR99	8542.32.00.36	4
IS43R16320E-5TL-TR Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	536.8709 Mbit	16	32MX16	2.5 V	700 ps			FOUR BANK PAGE BURST	DDR1 DRAM	AUTO/SELF REFRESH			1	1	32000000	33.5544 M	SYNCHRONOUS		YES					2.7 V	2.3 V	CMOS	COMMERCIAL	R-PDSO-G66				70 °C		NOT SPECIFIED	NOT SPECIFIED	66	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	650 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2070	TSOP2,	compliant	Mainland China, Taiwan	EAR99	8542.32.00.28	4
IS42S16160J-7TL Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH			1	1	16000000	16.7772 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54				70 °C		NOT SPECIFIED	NOT SPECIFIED	54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2070		compliant	Mainland China, Taiwan	EAR99	8542.32.00.24	4
MT47H128M8SH-25E:M Micron Technology Inc		Query price and inventory		Yes	Yes	Active	1.0737 Gbit	8	128MX8	1.8 V	400 ps	400 MHz	8192	MULTI BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	4,8	7 mA		210 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B60	Not Qualified	e1		85 °C		260	30	60	PLASTIC/EPOXY	TFBGA	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	10 mm	8 mm	2190	FBGA-60	compliant	Mainland China, Malaysia, Taiwan	EAR99	8542.32.00.32	5	BGA	60
IS42S16160J-6BLI Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH			1	1	16000000	16.7772 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	INDUSTRIAL	S-PBGA-B54		e1		85 °C	-40 °C	260		54	PLASTIC/EPOXY	TFBGA		SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	8 mm	8 mm	2070		compliant	Mainland China, Taiwan	EAR99	8542.32.00.24	4
MT47H32M16NF-25E:H Micron Technology Inc		Query price and inventory		Yes	Yes	Active	536.8709 Mbit	16	32MX16	1.8 V	400 ps	400 MHz	8192	FOUR BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	32000000	33.5544 M	SYNCHRONOUS	3-STATE	YES	4,8	10 mA		215 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84	Not Qualified	e1		85 °C		260	30	84	PLASTIC/EPOXY	TFBGA	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	8 mm	2190	FBGA-84	not_compliant		EAR99	8542.32.00.28	4.75	BGA	84
MT46V64M8P-5B:J Micron Technology Inc		Query price and inventory			Yes	Active	536.8709 Mbit	8	64MX8	2.6 V	700 ps	200 MHz	8192	FOUR BANK PAGE BURST	DDR1 DRAM	AUTO/SELF REFRESH	COMMON	2,4,8	1	1	64000000	536.8709 M	SYNCHRONOUS	3-STATE	YES	2,4,8	5 mA		230 µA	2.7 V	2.5 V	CMOS	COMMERCIAL	R-PDSO-G66	Not Qualified	e3	3	70 °C		260	30	66	PLASTIC/EPOXY	TSOP2	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	Matte Tin (Sn)	GULL WING	650 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2190	TSOP-66	compliant		EAR99	8542.32.00.28	4.25	TSOP	66
MT48LC16M16A2B4-6A:G Micron Technology Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	167 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS	3-STATE	YES	1,2,4,8,FP	2.5 mA		150 µA	3.6 V	3 V	CMOS	COMMERCIAL	S-PBGA-B54	Not Qualified	e1		70 °C		260	30	54	PLASTIC/EPOXY	VFBGA	BGA54,9X9,32	SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1 mm	8 mm	8 mm	2190	8 X 8 MM, LEAD FREE, VFBGA-54	compliant		EAR99	8542.32.00.24	4
AS4C4M16SA-6TCN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
MT41K128M16JT-125:K Micron Technology Inc		Query price and inventory		Yes	Yes	Active	2.1475 Gbit	16	128MX16	1.35 V	225 ps	800 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM	AUTO/SELF REFRESH	COMMON	8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	8	12 mA		195 µA	1.45 V	1.283 V	CMOS	OTHER	R-PBGA-B96	Not Qualified	e1		95 °C		260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190		compliant		EAR99	8542.32.00.36	5.1	BGA	96

Parts						Most Relevant								Technical																			Compliance			Operating Conditions					Physical											Dimensions			Other
Parts	Datasheet	Price/Stock	Risk Rank	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	mfrid	Package Description	Reach Compliance Code	Country Of Origin	ECCN Code	HTS Code	YTEOL	Part Package Code	Pin Count
AS4C4M16SA-6TIN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	INDUSTRIAL	R-PDSO-G54			3	85 °C	-40 °C			54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C4M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54			3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C16M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	143 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS		YES	1,2,4,8,FP	20 mA	3 V	55 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.24	4
AS4C8M16SA-7TCN Alliance Memory Inc		Query price and inventory			Yes	Active	134.2177 Mbit	16	8MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	8000000	8.3886 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
AS4C16M16SA-7TCNTR Alliance Memory Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	143 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS		YES	1,2,4,8,FP	20 mA		55 µA	3.6 V	3 V	CMOS		R-PDSO-G54			3	70 °C				54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.24	4
MT47H128M16RT-25E:C Micron Technology Inc		Query price and inventory		Yes	Yes	Active	2.1475 Gbit	16	128MX16	1.8 V	400 ps	400 MHz	8192	MULTI BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	4,8	12 mA		330 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84	Not Qualified	e1		85 °C		260	30	84	PLASTIC/EPOXY	TFBGA	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	9 mm	2190	9 X 12.50 MM, ROHS COMPLIANT, FBGA-84	compliant		EAR99	8542.32.00.36	4.75	BGA	84
MT48LC8M16A2P-6A:L Micron Technology Inc		Query price and inventory			Yes	Active	134.2177 Mbit	16	8MX16	3.3 V	5.4 ns	167 MHz	4096	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	8000000	8.3886 M	SYNCHRONOUS	3-STATE	YES	1,2,4,8,FP	2.5 mA		100 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54	Not Qualified	e3		70 °C		260	30	54	PLASTIC/EPOXY	TSOP2	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	MATTE TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2190	0.400 INCH, LEAD FREE, PLASTIC, TSOP2-54	compliant		EAR99	8542.32.00.02	4	TSOP2	54
MT41K64M16TW-107:J Micron Technology Inc		Query price and inventory			Yes	Active	1.0737 Gbit	16	64MX16	1.35 V		933 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM		COMMON	8	1	1	64000000	67.1089 M	SYNCHRONOUS	3-STATE	YES	8	28 mA		219 µA	1.45 V	1.283 V	CMOS		R-PBGA-B96	Not Qualified	e1		95 °C		NOT SPECIFIED	NOT SPECIFIED	96	PLASTIC/EPOXY	TFBGA	BGA96,6X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190	8 X 14 MM, LEAD FREE, FBGA-96	compliant		EAR99	8542.32.00.32	5.07
AS4C32M16D2A-25BCN Alliance Memory Inc		Query price and inventory			Yes	Active	536.8709 Mbit	16	32MX16	1.8 V	400 ps			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	32000000	33.5544 M	SYNCHRONOUS		YES					1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84			3	85 °C				84	PLASTIC/EPOXY	TFBGA		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES		BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	8 mm	1689	FBGA-84	compliant	Taiwan	EAR99	8542.32.00.28	4
MT41K256M16TW-107:P Micron Technology Inc		Query price and inventory			Yes	Active	4.295 Gbit	16	256MX16	1.35 V	195 ps	933 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM		COMMON	8	1	1	256000000	268.4355 M	SYNCHRONOUS	3-STATE	YES	8				1.45 V	1.283 V	CMOS	OTHER	R-PBGA-B96				95 °C		260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190	FBGA-96	not_compliant		EAR99	8542.32.00.36	5.15
IS43TR16256BL-107MBLI Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	4.295 Gbit	16	256MX16	1.35 V			8192	MULTI BANK PAGE BURST	DDR3 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	256000000	268.4355 M	SYNCHRONOUS	3-STATE	YES	4,8				1.45 V	1.283 V	CMOS	INDUSTRIAL	R-PBGA-B96		e1	3	95 °C	-40 °C	260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	13 mm	9 mm	2070	FBGA-96	compliant	Mainland China, Taiwan	EAR99	8542.32.00.36	4
IS43R16320E-5TL-TR Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	536.8709 Mbit	16	32MX16	2.5 V	700 ps			FOUR BANK PAGE BURST	DDR1 DRAM	AUTO/SELF REFRESH			1	1	32000000	33.5544 M	SYNCHRONOUS		YES					2.7 V	2.3 V	CMOS	COMMERCIAL	R-PDSO-G66				70 °C		NOT SPECIFIED	NOT SPECIFIED	66	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	650 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2070	TSOP2,	compliant	Mainland China, Taiwan	EAR99	8542.32.00.28	4
IS42S16160J-7TL Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH			1	1	16000000	16.7772 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54				70 °C		NOT SPECIFIED	NOT SPECIFIED	54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES		GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2070		compliant	Mainland China, Taiwan	EAR99	8542.32.00.24	4
MT47H128M8SH-25E:M Micron Technology Inc		Query price and inventory		Yes	Yes	Active	1.0737 Gbit	8	128MX8	1.8 V	400 ps	400 MHz	8192	MULTI BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	4,8	7 mA		210 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B60	Not Qualified	e1		85 °C		260	30	60	PLASTIC/EPOXY	TFBGA	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	10 mm	8 mm	2190	FBGA-60	compliant	Mainland China, Malaysia, Taiwan	EAR99	8542.32.00.32	5	BGA	60
IS42S16160J-6BLI Integrated Silicon Solution Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH			1	1	16000000	16.7772 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	INDUSTRIAL	S-PBGA-B54		e1		85 °C	-40 °C	260		54	PLASTIC/EPOXY	TFBGA		SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	8 mm	8 mm	2070		compliant	Mainland China, Taiwan	EAR99	8542.32.00.24	4
MT47H32M16NF-25E:H Micron Technology Inc		Query price and inventory		Yes	Yes	Active	536.8709 Mbit	16	32MX16	1.8 V	400 ps	400 MHz	8192	FOUR BANK PAGE BURST	DDR2 DRAM	AUTO/SELF REFRESH	COMMON	4,8	1	1	32000000	33.5544 M	SYNCHRONOUS	3-STATE	YES	4,8	10 mA		215 µA	1.9 V	1.7 V	CMOS	OTHER	R-PBGA-B84	Not Qualified	e1		85 °C		260	30	84	PLASTIC/EPOXY	TFBGA	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BALL	800 µm	BOTTOM	1.2 mm	12.5 mm	8 mm	2190	FBGA-84	not_compliant		EAR99	8542.32.00.28	4.75	BGA	84
MT46V64M8P-5B:J Micron Technology Inc		Query price and inventory			Yes	Active	536.8709 Mbit	8	64MX8	2.6 V	700 ps	200 MHz	8192	FOUR BANK PAGE BURST	DDR1 DRAM	AUTO/SELF REFRESH	COMMON	2,4,8	1	1	64000000	536.8709 M	SYNCHRONOUS	3-STATE	YES	2,4,8	5 mA		230 µA	2.7 V	2.5 V	CMOS	COMMERCIAL	R-PDSO-G66	Not Qualified	e3	3	70 °C		260	30	66	PLASTIC/EPOXY	TSOP2	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	Matte Tin (Sn)	GULL WING	650 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	2190	TSOP-66	compliant		EAR99	8542.32.00.28	4.25	TSOP	66
MT48LC16M16A2B4-6A:G Micron Technology Inc		Query price and inventory			Yes	Active	268.4355 Mbit	16	16MX16	3.3 V	5.4 ns	167 MHz	8192	FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH	COMMON	1,2,4,8	1	1	16000000	16.7772 M	SYNCHRONOUS	3-STATE	YES	1,2,4,8,FP	2.5 mA		150 µA	3.6 V	3 V	CMOS	COMMERCIAL	S-PBGA-B54	Not Qualified	e1		70 °C		260	30	54	PLASTIC/EPOXY	VFBGA	BGA54,9X9,32	SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1 mm	8 mm	8 mm	2190	8 X 8 MM, LEAD FREE, VFBGA-54	compliant		EAR99	8542.32.00.24	4
AS4C4M16SA-6TCN Alliance Memory Inc		Query price and inventory			Yes	Active	67.1089 Mbit	16	4MX16	3.3 V	5.4 ns			FOUR BANK PAGE BURST	SYNCHRONOUS DRAM	AUTO/SELF REFRESH			1	1	4000000	4.1943 M	SYNCHRONOUS		YES					3.6 V	3 V	CMOS	COMMERCIAL	R-PDSO-G54		e3	3	70 °C				54	PLASTIC/EPOXY	TSOP2		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	YES	TIN	GULL WING	800 µm	DUAL	1.2 mm	22.22 mm	10.16 mm	1689	TSOP2-54	compliant	Taiwan	EAR99	8542.32.00.02	4
MT41K128M16JT-125:K Micron Technology Inc		Query price and inventory		Yes	Yes	Active	2.1475 Gbit	16	128MX16	1.35 V	225 ps	800 MHz	8192	MULTI BANK PAGE BURST	DDR3L DRAM	AUTO/SELF REFRESH	COMMON	8	1	1	128000000	134.2177 M	SYNCHRONOUS	3-STATE	YES	8	12 mA		195 µA	1.45 V	1.283 V	CMOS	OTHER	R-PBGA-B96	Not Qualified	e1		95 °C		260	30	96	PLASTIC/EPOXY	TFBGA	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	YES	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.2 mm	14 mm	8 mm	2190		compliant		EAR99	8542.32.00.36	5.1	BGA	96

1 2 3 4 5 下一页

ICP Business License 苏B2-20140176 苏ICP备14012660号-4
Copyright@Suzhou Lingdongzhenge Network Technology Co., Ltd.

苏公网安备 32059002001042号

Contact Us

US Headquarters

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

Suzhou Office

Zhongxin Building, No. 15 Moon Bay Road, Suzhou Industrial Park 4406-4411

Suzhou City, Jiangsu Province, 215021

Email：service@bom2buy.com

phone：(0512) 62988549

DRAMs:

Help

Related Sites

Contact Us

US Headquarters

Suzhou Office

Create BOM

Sign In

DRAMs:

Help

Related Sites

Contact Us

US Headquarters

Suzhou Office