所有内容版权所有 © 2006 - 2025
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| 型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||
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| 数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 运营商类型（2） | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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mfrid
|
零件包装代码
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包装说明
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针数
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制造商包装代码
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是否符合REACH标准
|
ECCN代码
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HTS代码
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Country Of Origin
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YTEOL
|
Date Of Intro
|
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82V2108PXG
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG | 2068 | PQFP | GREEN, PLASTIC, QFP-128 | 128 | PXG128 | compliant | EAR99 | 8542.39.00.01 | ||||||||
|
DS34T108GN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.8 V | 1 | 550 µA | INDUSTRIAL | FRAMER | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | 2164 | BGA | 23 X 23 MM, ROHS COMPLIANT, HSBGA-484 | 484 | compliant | EAR99 | 8542.39.00.01 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||
|
82V2108PXG
Renesas Electronics Corporation
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG | 2354 | PQFP | GREEN, PLASTIC, QFP-128 | 128 | PXG128 | compliant | NLR | 8542390001 | ||||||||
|
MT8979APR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | 16 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2188 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | ||||||||||||||||||
|
PM4358-NGI
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | CABGA-256 | compliant | 5A991.B | 8542.31.00.01 | Mainland China, Philippines | 19 | |||||||||||||||||||||
|
DS26518GN+
Analog Devices Inc
|
查询价格和库存 |
|
Yes | Not Recommended | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 450 mA | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | DS26518GN+ | 1742 | 256-CSP_BGA-17X17X1.26 | 17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256 | 256 | 256-CSP_BGA-17X17X1.26 | compliant | Japan, Mainland China, Malaysia, Philipp... more | 3 | 2007-02-28 | ||||||||
|
DS2154LA2+
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | COMMERCIAL | 3 | 70 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2178096 | QFP | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 100 | unknown | ||||||||||||||
|
TFRA84J131BL-3
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | BGA909,34X34,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1778 | BGA, BGA909,34X34,40 | compliant | 8542.39.00.01 | |||||||||||||||||||
|
PM4351-RGI
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | 2188 | CABGA-81 | compliant | 5A991.B | 8542.31.00.01 | Philippines | 19 | ||||||||||||||||||||
|
TTSI004161BL-2
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||||
|
L-TFRA84J131BL-3
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||||
|
TTSI001041BL-2
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
TTSI001041BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
L-TTSI001041BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
L-TTSI004161BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
L-TFRA84J131BL-3
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
TTSI004161BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
L-TTSI001041BL-2
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
TTSI002081BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
|
L-TTSI004161BL-2
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||||
所有内容版权所有 © 2006 - 2025
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
