型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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包装说明
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是否符合REACH标准
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HTS代码
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YTEOL
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零件包装代码
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针数
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Source Content uid
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ECCN代码
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TFRA84J131BL-21
Broadcom Limited
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查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 909 | PLASTIC/EPOXY | BGA | BGA909,34X34,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1807 | BGA, BGA909,34X34,40 | compliant | 8542.39.00.01 | |||||||||||
TTSI2K32T
Avago Technologies
|
查询价格和库存 |
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Active | 3.3 V | CMOS | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | 1778 | BGA, | unknown | 8542.39.00.01 | |||||||||||
T7230A--ML
Broadcom Limited
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查询价格和库存 |
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Active | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.2316 mm | 24.2316 mm | 5.08 mm | 1807 | PLASTIC, LCC-68 | compliant | 8542.39.00.01 | 2 | ||||||||||
TFRA08C13
Avago Technologies
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查询价格和库存 |
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Active | 3.3 V | CMOS | 8 | FRAMER | X-PBGA-B352 | e0 | Not Qualified | 225 | 30 | 352 | PLASTIC/EPOXY | BGA | UNSPECIFIED | GRID ARRAY | YES | TIN LEAD | BALL | BOTTOM | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||||
T7230A--TL
Avago Technologies
|
查询价格和库存 |
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Active | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 80 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 12 mm | 12 mm | 1.6 mm | 1778 | LFQFP, | unknown | 8542.39.00.01 | 2 | ||||||||||
TFRA08C13-DB
Avago Technologies
|
查询价格和库存 |
|
Active | 3.3 V | CMOS | 8 | INDUSTRIAL | FRAMER | S-PBGA-B352 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 352 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 2.54 mm | 1778 | BGA, | unknown | 8542.39.00.01 | |||||||||||
TFRA84J131BL-3
Broadcom Limited
|
查询价格和库存 |
|
No | Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | BGA909,34X34,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1807 | PLASTIC, BGA-909 | unknown | 8542.39.00.01 | ||||||||||||
PM4359-NGI
Microchip Technology Inc
|
查询价格和库存 |
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Yes | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | 17 X 17 MM, ROHS COMPLIANT, CABGA-256 | compliant | |||||||||||||||||||
T-7630---TL-DB
Broadcom Limited
|
查询价格和库存 |
|
Active | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G144 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 1807 | TQFP-144 | compliant | 8542.39.00.01 | 2 | ||||||||||
TTSI008321BL-1
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||
TFRA28J133BAL-1-DB
Broadcom Limited
|
查询价格和库存 |
|
Active | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B456 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 456 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 2.54 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||
T-7633---TL-DB
Broadcom Limited
|
查询价格和库存 |
|
Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G144 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 1807 | TQFP-144 | compliant | 8542.39.00.01 | 2 | ||||||||||
TTSI016641BL-1
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B324 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.51 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||
TTSI144641BL-1
Avago Technologies
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B388 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.51 mm | 1778 | BGA, | unknown | 8542.39.00.01 | ||||||||||||
MT9079AP1
Microsemi Corporation
|
查询价格和库存 |
|
Transferred | FRAMER | 2192 | compliant | 8542.39.00.01 | LPCC | 44 | ||||||||||||||||||||||||||||||||||
MT9079APR
Microsemi Corporation
|
查询价格和库存 |
|
Transferred | FRAMER | 2192 | compliant | 8542.39.00.01 | LPCC | 44 | ||||||||||||||||||||||||||||||||||
MT8979APR1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2192 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | LPCC | 44 | |||||||||
MT9076BB1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Obsolete | 3.3 V | 1 | 98 mA | INDUSTRIAL | FRAMER | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2188 | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80 | compliant | 0 | ||||||||||||
82V2108PXG8
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 2068 | PLASTIC, QFP-128 | compliant | 8542.39.00.01 | QFP | 128 | 82V2108PXG8 | EAR99 | ||||||
PEB2035-N
Siemens
|
查询价格和库存 |
|
Transferred | 5 V | CMOS | 1 | COMMERCIAL | FRAMER | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2403 | , | unknown | 8542.39.00.01 | LCC | 44 |