93LC46BT-I/ST中文资料_PDF数据手册

93LC46BT-I/ST

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Microchip Technology Inc

64 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

技术详情

价格 & 库存

详细参数

Source Content uid

93LC46BT-I/ST

不含铅

符合

Active

SOIC

TSSOP, TSSOP8,.25

compliant

EAR99

8542.32.00.51

8 weeks

593

0.54

2 MHz

200

R-PDSO-G8

4.4 mm

1024 bit

EEPROM

64 words

SYNCHRONOUS

85 °C

-40 °C

64X16

TOTEM POLE

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SERIAL

260

Not Qualified

YES

TS 16949

1.2 mm

MICROWIRE

0.000001 A

0.002 mA

5.5 V

2.5 V

3 V

YES

CMOS

INDUSTRIAL

Matte Tin (Sn)

GULL WING

0.65 mm

DUAL

3 mm

6 ms

SOFTWARE

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93AA46 Microchip Technology Inc 也适用于 93AA46BT-I/SNG ,93LC46B-I/PG ,93AA46B-I/SNG 等其余

参考设计

(1)

SimpleLink™ Wi-Fi® CC3200 Module LaunchPad

TIDC-CC3200MODLAUNCHXL: The CC3200MODLAUNCHXL is a low-cost evaluation platform which hosts the CC3200MOD. The SimpleLink™ CC3200MOD is a wireless microcontroller (MCU) module that integrates an ARM® Cortex™-M4 based MCU, allowing customers to develop an entire application using a single device. The module LaunchPad also features programmable user buttons, RGB LED for custom applications, temperature and accelerometer sensors, as well as onboard emulation for debugging. The LaunchPad stackable headers interface demonstrates how to expand the functionality of the CC3200MOD when interfacing with other peripherals on existing BoosterPack add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.

< / 共 1 个参考设计 >

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