2-382811-1中文资料_PDF数据手册

2-382811-1

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SHUNT, ECON, PHBRSN, BLACK

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详细参数

Source Content uid

2-382811-1

Brand Name

AMP

不含铅

符合

Active

compliant

EAR99

9 weeks 1 day

2399

0.42

0.2 inch

0.25 inch

2.498 inch

PLUG

INTERCONNECTION DEVICE

NOT APPLICABLE

FEMALE

NOT APPLICABLE

RECTANGULAR

15 mΩ

SQ PIN-SKT

25 Cycles

YES

1000000000 Ω

BLACK

GLASS FILLED POLYESTER

0.1 inch

STRAIGHT

BOARD

ONE

85 °C

-40 °C

GENERAL PURPOSE

100u inch

3 A

CSA, UL

2.54 mm

SOLDER

94V-0

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2-382811-1 TE's AMP 也适用于 2-382811-1

参考设计

(2)

Intel IMVP7 2nd Generation Core Mobile (Core i7) Power Management Reference Design

TIDA-00020: The Intel Core i7 power management design is a complete solution for the Intel™ IMVP-7 Serial VID (SVID) Power System The design features an IMVP-7 3-Phase CPU supply, a single-phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.

Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design

TIDA-00021: The Intel Core i7 power management design is a complete solution for Intel IMVP-7 SVID. A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC Controller. The design features an IMVP-7 3-Phase CPU supply, a 2 Phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.

< / 共 2 个参考设计 >

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