内存控制器封装型号_内存控制器厂家价格-bom2buy

型号

型号				Most Relevant					Technical											Compliance		Operating Conditions		Physical									Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	总线兼容性	外部数据总线宽度	地址总线宽度	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	其他特性	边界扫描	低功率模式	内存组织	区块数量	最大压摆率	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	最高工作温度	最低工作温度	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	Country Of Origin	YTEOL
INTEL-E7501MCH Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1005	Not Qualified			1005	PLASTIC/EPOXY	BGA	BGA1005,33X33,50	SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM				2071	BGA, BGA1005,33X33,50	compliant	8542.31.00.01
INTEL-82910GMLE Intel Corporation		查询价格和库存		Active				YES			CMOS										R-PBGA-B1257	Not Qualified			1257	PLASTIC/EPOXY	BGA	BGA1257,34X37,40	RECTANGULAR	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1257,34X37,40	compliant	8542.31.00.01
82439HX Intel Corporation		查询价格和库存		Active	PENTIUM	32	64	YES	3.3 V	MEMORY CONTROLLER, DRAM	CMOS	0 TO 85 C OPERATING CASE TEMPERATURE	NO	YES	512M X 8	8		3.6 V	3.135 V		S-PBGA-B324	Not Qualified			324	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM	2.3 mm	27 mm	27 mm	2071	BGA,	compliant	8542.31.00.01	BGA	324
INTEL-82915GM Intel Corporation		查询价格和库存		Active				YES			CMOS										R-PBGA-B1257	Not Qualified			1257	PLASTIC/EPOXY	BGA	BGA1257,34X37,40	RECTANGULAR	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1257,34X37,40	compliant	8542.31.00.01
INTEL-82945GU Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1249	Not Qualified			1249	PLASTIC/EPOXY	FBGA	BGA1249,50X50,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1249,50X50,32	compliant	8542.31.00.01
INTEL-82Q33GMCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-82945G Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1202	Not Qualified			1202	PLASTIC/EPOXY	FBGA	BGA1202,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1202,43X43,32	compliant	8542.31.00.01
AM2970XC AMD		查询价格和库存		Active					5 V		TTL						125 mA			COMMERCIAL		Not Qualified	70 °C					DIE OR CHIP									1653		compliant	8542.31.00.01			Malaysia	2
82451NX Intel Corporation		查询价格和库存		Active				YES		MEMORY CONTROLLER, DRAM	CMOS										S-PBGA-B540	Not Qualified			540	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM	4.1 mm	42.5 mm	42.5 mm	2071	BGA-540	compliant	8542.31.00.01	BGA	540
MB1430ASP FUJITSU Semiconductor Limited		查询价格和库存		Active				NO	5 V		TTL						145 mA			COMMERCIAL	R-PDIP-T42	Not Qualified	70 °C		42	PLASTIC/EPOXY	SDIP	SDIP42,.6	RECTANGULAR	IN-LINE, SHRINK PITCH	THROUGH-HOLE	1.78 mm	DUAL				4317229	SDIP, SDIP42,.6	compliant	8542.31.00.01
INTEL-82P35MCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-5000P Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1432	Not Qualified			1432	PLASTIC/EPOXY	BGA	BGA1432,38X38,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1432,38X38,40	compliant	8542.31.00.01
82865GV Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B932	Not Qualified			932	PLASTIC/EPOXY	BGA	BGA932,35X35,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA932,35X35,40	compliant	8542.31.00.01
AM29C688XC AMD		查询价格和库存		Active					5 V		CMOS						325 mA			COMMERCIAL		Not Qualified	70 °C					DIE OR CHIP									1653		compliant	8542.31.00.01			Malaysia	2
INTEL-E7221MCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1092	Not Qualified			1092	PLASTIC/EPOXY	BGA	BGA1092,35X35,43/32	SQUARE	GRID ARRAY	BALL	800 µm	BOTTOM				2071	BGA, BGA1092,35X35,43/32	compliant	8542.31.00.01
INTEL-82945GMS Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B988	Not Qualified			988	PLASTIC/EPOXY	FBGA	BGA988,33X33,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA988,33X33,32	compliant	8542.31.00.01
FW82845GV Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B478	Not Qualified			478	PLASTIC/EPOXY	BGA	BGA478,37X37,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA478,37X37,40	compliant	8542.31.00.01
GT-64012 Marvell Technology Group Ltd		查询价格和库存		Active				YES	5 V								100 mA				S-PQCC-J44	Not Qualified			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	J BEND	1.27 mm	QUAD				2161	QCCJ, LDCC44,.7SQ	compliant	8542.31.00.01
INTEL-82Q35GMCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-5000Z Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1432	Not Qualified			1432	PLASTIC/EPOXY	BGA	BGA1432,38X38,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1432,38X38,40	compliant	8542.31.00.01

型号				Most Relevant					Technical											Compliance		Operating Conditions		Physical									Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	总线兼容性	外部数据总线宽度	地址总线宽度	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	其他特性	边界扫描	低功率模式	内存组织	区块数量	最大压摆率	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	最高工作温度	最低工作温度	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	Country Of Origin	YTEOL
INTEL-E7501MCH Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1005	Not Qualified			1005	PLASTIC/EPOXY	BGA	BGA1005,33X33,50	SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM				2071	BGA, BGA1005,33X33,50	compliant	8542.31.00.01
INTEL-82910GMLE Intel Corporation		查询价格和库存		Active				YES			CMOS										R-PBGA-B1257	Not Qualified			1257	PLASTIC/EPOXY	BGA	BGA1257,34X37,40	RECTANGULAR	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1257,34X37,40	compliant	8542.31.00.01
82439HX Intel Corporation		查询价格和库存		Active	PENTIUM	32	64	YES	3.3 V	MEMORY CONTROLLER, DRAM	CMOS	0 TO 85 C OPERATING CASE TEMPERATURE	NO	YES	512M X 8	8		3.6 V	3.135 V		S-PBGA-B324	Not Qualified			324	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM	2.3 mm	27 mm	27 mm	2071	BGA,	compliant	8542.31.00.01	BGA	324
INTEL-82915GM Intel Corporation		查询价格和库存		Active				YES			CMOS										R-PBGA-B1257	Not Qualified			1257	PLASTIC/EPOXY	BGA	BGA1257,34X37,40	RECTANGULAR	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1257,34X37,40	compliant	8542.31.00.01
INTEL-82945GU Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1249	Not Qualified			1249	PLASTIC/EPOXY	FBGA	BGA1249,50X50,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1249,50X50,32	compliant	8542.31.00.01
INTEL-82Q33GMCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-82945G Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1202	Not Qualified			1202	PLASTIC/EPOXY	FBGA	BGA1202,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1202,43X43,32	compliant	8542.31.00.01
AM2970XC AMD		查询价格和库存		Active					5 V		TTL						125 mA			COMMERCIAL		Not Qualified	70 °C					DIE OR CHIP									1653		compliant	8542.31.00.01			Malaysia	2
82451NX Intel Corporation		查询价格和库存		Active				YES		MEMORY CONTROLLER, DRAM	CMOS										S-PBGA-B540	Not Qualified			540	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	BALL	1.27 mm	BOTTOM	4.1 mm	42.5 mm	42.5 mm	2071	BGA-540	compliant	8542.31.00.01	BGA	540
MB1430ASP FUJITSU Semiconductor Limited		查询价格和库存		Active				NO	5 V		TTL						145 mA			COMMERCIAL	R-PDIP-T42	Not Qualified	70 °C		42	PLASTIC/EPOXY	SDIP	SDIP42,.6	RECTANGULAR	IN-LINE, SHRINK PITCH	THROUGH-HOLE	1.78 mm	DUAL				4317229	SDIP, SDIP42,.6	compliant	8542.31.00.01
INTEL-82P35MCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-5000P Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1432	Not Qualified			1432	PLASTIC/EPOXY	BGA	BGA1432,38X38,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1432,38X38,40	compliant	8542.31.00.01
82865GV Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B932	Not Qualified			932	PLASTIC/EPOXY	BGA	BGA932,35X35,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA932,35X35,40	compliant	8542.31.00.01
AM29C688XC AMD		查询价格和库存		Active					5 V		CMOS						325 mA			COMMERCIAL		Not Qualified	70 °C					DIE OR CHIP									1653		compliant	8542.31.00.01			Malaysia	2
INTEL-E7221MCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1092	Not Qualified			1092	PLASTIC/EPOXY	BGA	BGA1092,35X35,43/32	SQUARE	GRID ARRAY	BALL	800 µm	BOTTOM				2071	BGA, BGA1092,35X35,43/32	compliant	8542.31.00.01
INTEL-82945GMS Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B988	Not Qualified			988	PLASTIC/EPOXY	FBGA	BGA988,33X33,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA988,33X33,32	compliant	8542.31.00.01
FW82845GV Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B478	Not Qualified			478	PLASTIC/EPOXY	BGA	BGA478,37X37,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA478,37X37,40	compliant	8542.31.00.01
GT-64012 Marvell Technology Group Ltd		查询价格和库存		Active				YES	5 V								100 mA				S-PQCC-J44	Not Qualified			44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	J BEND	1.27 mm	QUAD				2161	QCCJ, LDCC44,.7SQ	compliant	8542.31.00.01
INTEL-82Q35GMCH Intel Corporation		查询价格和库存		Active				YES													S-PBGA-B1226	Not Qualified			1226	PLASTIC/EPOXY	FBGA	BGA1226,43X43,32	SQUARE	GRID ARRAY, FINE PITCH	BALL	800 µm	BOTTOM				2071	FBGA, BGA1226,43X43,32	compliant	8542.31.00.01
INTEL-5000Z Intel Corporation		查询价格和库存		Active				YES			CMOS										S-PBGA-B1432	Not Qualified			1432	PLASTIC/EPOXY	BGA	BGA1432,38X38,40	SQUARE	GRID ARRAY	BALL	1 mm	BOTTOM				2071	BGA, BGA1432,38X38,40	compliant	8542.31.00.01

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