Parts | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet |
Price/Stock
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Risk Rank | Pbfree Code |
Rohs Code
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Part Life Cycle Code | Memory Density | Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max | Clock Frequency-Max (fCLK) | Cycle Time | Memory IC Type | Additional Feature | Alternate Memory Width | Number of Functions | Number of Words Code | Number of Words | Operating Mode | Output Characteristics | Output Enable | Parallel/Serial |
Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code |
Qualification Status
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JESD-609 Code | Moisture Sensitivity Level | Operating Temperature-Max | Operating Temperature-Min | Peak Reflow Temperature (Cel) |
Time@Peak Reflow Temperature-Max (s)
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Number of Terminals | Package Body Material | Package Code | Package Equivalence Code | Package Shape | Package Style |
Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length |
Width
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Source Content uid
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mfrid
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Part Package Code
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Package Description
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Pin Count
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Manufacturer Package Code
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Reach Compliance Code
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ECCN Code
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HTS Code
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Date Of Intro
|
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72V283L7-5BC
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 589.824 kbit | 18 | 32KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | IT CAN ALSO BE CONFIGURED AS 64K X 9; RE... more | 9 | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | 72V283L7-5BC | 2068 | CABGA | 11 X 11 MM, 1 MM PITCH, BGA-100 | 100 | BC100 | not_compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | |||
72V85L15PAG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | 72V85L15PAG | 2068 | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 | ||||
7202LA12TPG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 70 °C | 260 | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 34.671 mm | 7.62 mm | 7202LA12TPG | 2068 | PDIP | GREEN, PLASTIC, DIP-28 | 28 | PTG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||
7201LA12TPG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 4.608 kbit | 9 | 512X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 70 °C | 260 | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 34.671 mm | 7.62 mm | 7201LA12TPG | 2068 | PDIP | GREEN, PLASTIC, DIP-28 | 28 | PTG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||
72241L10JG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 36.864 kbit | 9 | 4KX9 | 5 V | 6.5 ns | 10 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 5 mA | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PLCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | RECTANGULAR | YES | Matte Tin (Sn) - annealed | J BEND | QUAD | 72241L10JG | 2068 | PLCC | LCC-32 | 32 | PLG32 | compliant | EAR99 | 8542.32.00.71 | 1992-01-01 | ||||||||||||
7203L12JG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 18.432 kbit | 9 | 2KX9 | 5 V | 12 ns | 20 ns | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 7203L12JG | 2068 | PLCC | GREEN, PLASTIC, LCC-32 | 32 | PLG32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||||||
72V2105L15PFGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.63SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V2105L15PFGI | 2068 | TQFP | TQFP-64 | 64 | PNG64 | compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | |||||
72T18125L4-4BBG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 2.5 V | 3.4 ns | 100 MHz | 4.44 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 512000 | 524.288 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 70 °C | 260 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | 72T18125L4-4BBG | 2068 | PBGA | BGA-240 | 240 | BBG240 | compliant | EAR99 | 8542.32.00.71 | |||||
7282L12PAG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 15 mA | 125 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | 7282L12PAG | 2068 | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 | ||||
72V293L6PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 4 ns | 166 MHz | 6 ns | OTHER FIFO | IT CAN ALSO BE CONFIGURED AS 128K X 9; R... more | 9 | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V293L6PFG | 2068 | TQFP | GREEN, PLASTIC, TQFP-80 | 80 | PNG80 | compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | |||
72V285L10TFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 589.824 kbit | 18 | 32KX18 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 72V285L10TFG | 2068 | TQFP | STQFP-64 | 64 | PPG64 | compliant | EAR99 | 8542.32.00.71 | 1998-07-01 | |||||
723642L15PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 36.864 kbit | 36 | 1KX36 | 5 V | 10 ns | 66.7 MHz | 15 ns | BI-DIRECTIONAL FIFO | MAILBOX | 1 | 1000 | 1.024 k | SYNCHRONOUS | YES | PARALLEL | 1 mA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G120 | Not Qualified | e3 | 3 | 70 °C | 260 | 120 | PLASTIC/EPOXY | LFQFP | QFP120,.63SQ,16 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN | GULL WING | 400 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 723642L15PFG | 2068 | TQFP | TQFP-120 | 120 | PNG120 | compliant | EAR99 | 8542.32.00.71 | |||||||
72V3670L10PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 294.912 kbit | 36 | 8KX36 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 40 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | R-PQFP-G128 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 20 mm | 14 mm | 72V3670L10PFG | 2068 | TQFP | TQFP-128 | 128 | PKG128 | compliant | EAR99 | 8542.32.00.71 | 1998-10-01 | ||||
72T36115L6-7BB
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 2.5 V | 3.8 ns | 150 MHz | 6.7 ns | OTHER FIFO | ASYNCHRONOUS OPERATION ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 10 mA | 60 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | 72T36115L6-7BB | 2068 | PBGA | BGA-240 | 240 | BB240 | not_compliant | EAR99 | 8542.32.00.71 | |||||
72V815L10PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.216 kbit | 18 | 512X18 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | 1 | 512 | 512 words | SYNCHRONOUS | YES | PARALLEL | 10 mA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PQFP-G128 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 20 mm | 14 mm | 72V815L10PFG | 2068 | TQFP | TQFP-128 | 128 | PKG128 | compliant | EAR99 | 8542.32.00.71 | 1995-01-01 | |||||
72V3642L10PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 36.864 kbit | 36 | 1KX36 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | BI-DIRECTIONAL FIFO | MAIL BOX BYPASS REGISTER | 1 | 1000 | 1.024 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PQFP-G120 | Not Qualified | e3 | 3 | 70 °C | 260 | 120 | PLASTIC/EPOXY | LFQFP | QFP120,.63SQ,16 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN | GULL WING | 400 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V3642L10PFG | 2068 | TQFP | GREEN, TQFP-120 | 120 | PNG120 | compliant | EAR99 | 8542.32.00.71 | |||||||
72V223L6BC
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 9.216 kbit | 18 | 512X18 | 3.3 V | 4 ns | 166 MHz | 6 ns | OTHER FIFO | IT CAN ALSO BE CONFIGURED AS 1K X 9; RET... more | 9 | 1 | 512 | 512 words | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | 72V223L6BC | 2068 | CABGA | 11 X 11 MM, 1 MM PITCH, BGA-100 | 100 | BC100 | not_compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | |||
72V06L25JGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 3.3 V | 25 ns | 35 ns | RETRANSMIT | 1 | 16000 | 16.384 k | ASYNCHRONOUS | NO | PARALLEL | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 72V06L25JGI | 2068 | PLCC | LCC-32 | 32 | PLG32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | ||||||||
72V04L15JG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 36.864 kbit | 9 | 4KX9 | 3.3 V | 15 ns | 25 ns | RETRANSMIT | 1 | 4000 | 4.096 k | ASYNCHRONOUS | NO | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 72V04L15JG | 2068 | PLCC | LCC-32 | 32 | PLG32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||||||
723624L15PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.216 kbit | 36 | 256X36 | 5 V | 10 ns | 15 ns | AUTO POWER DOWN | 1 | 256 | 256 words | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQFP-G128 | e3 | 3 | 70 °C | 260 | 128 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | TIN | GULL WING | QUAD | 723624L15PFG | 2068 | TQFP | TQFP-128 | 128 | PKG128 | compliant | EAR99 | 8542.32.00.71 |