型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
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最长访问时间 | 内存集成电路类型 | I/O 类型 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 | 最高工作温度 | 最低工作温度 |
筛选级别
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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mfrid
|
零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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HTS代码
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YTEOL
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Country Of Origin
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QP27C256L-300/XA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 300 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | HERMETIC SEALED, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
QP27C256L-150/ZA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | QFJ | CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
QP27C256-300/XA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 300 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | HERMETIC SEALED, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
QP27C256-170/UA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | QFJ | CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
QP27C256L-150/UA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-XQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | UNSPECIFIED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | QFJ | JLCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
FT27C256R-25LMB
Force Technologies Ltd
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 200 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 2.92 mm | 13.97 mm | 11.43 mm | 4317223 | QFJ | QCCN, LCC32,.45X.55 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | UK | |||
WS57C256F-55TMB
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 0.300 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
WS57C256F-55D
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | 3.75 | |||||||||||||||
WS57C256F-55T
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 0.300 INCH, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | 3.75 | |||||||||||||||
WS57C256F-55DMB
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||
WS57C256F-55DM
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | ||||||||||||||
AS27C256-17ECAXT
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | |||||
AS27C256-30JM
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.8928 mm | 15.24 mm | 1776 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | |||||
AS27C256-17ECAM/Q
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e4 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | RECTANGULAR | CHIP CARRIER, WINDOW | YES | PALLADIUM GOLD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | |||||||
AS27C256-30JI
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.8928 mm | 15.24 mm | 1776 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | 2 | ||||||
AS27C256-15ECAXT
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | |||||
AS27C256-17ECAI
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 170 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-N32 | Not Qualified | e4 | 85 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | PALLADIUM GOLD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.61 | 2 | |||
AS27C256-30JXT
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.8928 mm | 15.24 mm | 1776 | DIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | ||||||
AS27C256-15ECAM/Q
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e4 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | RECTANGULAR | CHIP CARRIER, WINDOW | YES | PALLADIUM GOLD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 | |||||||
AS27C256-15ECAM
Micross Components
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e4 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | PALLADIUM GOLD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 1776 | QFJ | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 2 |