型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) |
刷新周期
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访问模式 | 内存集成电路类型 | 其他特性 | I/O 类型 | 交错的突发长度 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 |
反向引出线
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自我刷新
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连续突发长度
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最大待机电流
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最小待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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mfrid
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是否符合REACH标准
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COO
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ECCN代码
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HTS代码
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YTEOL
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包装说明
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零件包装代码
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针数
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Date Of Intro
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AS4C32M16SB-7TCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.28 | 4 | ||||||||||||||||||||||
IS42VM16160K-75BLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 6 ns | 133 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 10 µA | 100 µA | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | S-PBGA-B54 | Not Qualified | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | 4 | FBGA-54 | ||||||||||||||
AS4C64M32MD2A-25BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 2.1475 Gbit | 32 | 64MX32 | 1.2 V | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.3 V | 1.14 V | CMOS | INDUSTRIAL | R-PBGA-B134 | 3 | 85 °C | -40 °C | 134 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 650 µm | BOTTOM | 1 mm | 11.5 mm | 10 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.36 | 4 | FBGA-134 | ||||||||||||||||||||||||
AS4C32M16SB-7TINTR
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 3.3 V | 5.4 ns | 143 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 60 mA | 150 µA | 3.6 V | 3 V | CMOS | R-PDSO-G54 | e3 | 3 | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TSOP2 | TSSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.28 | 4 | TSOP2-54 | ||||||||||||
IS42S16100H-7BLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3.3 V | 5.5 ns | 143 MHz | 2048 | DUAL BANK PAGE BURST | SYNCHRONOUS DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 3.5 mA | 70 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PBGA-B60 | Not Qualified | 85 °C | -40 °C | 60 | PLASTIC/EPOXY | TFBGA | BGA60,7X15,25 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 650 µm | BOTTOM | 1.2 mm | 10.1 mm | 6.4 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.02 | 4 | TFBGA-60 | ||||||||||||||
AS4C16M16D1A-5TIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 2.5 V | 700 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 5 mA | 2.3 V | 140 µA | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PDSO-G66 | 3 | 85 °C | -40 °C | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 4 | TSOPII-66 | ||||||||||||
MTA8ATF1G64HZ-3G2R1
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Active | DDR4 DRAM MODULE | 2190 | compliant | 0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AS4C64M16D2A-25BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | e1 | 3 | 85 °C | 265 | 20 | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.32 | 4 | FBGA-84 | |||||||||||||||||||||
MTA4ATF51264HZ-3G2R1
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Active | 34.3597 Gbit | 64 | 512MX64 | 1.2 V | 1.6 GHz | 8192 | MULTI BANK PAGE BURST | DDR4 DRAM MODULE | WD-MAX | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 96 mA | 900 µA | 1.26 V | 1.14 V | CMOS | R-PDMA-N260 | 95 °C | 260 | PLASTIC/EPOXY | DIMM | DIMM260,20 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 500 µm | DUAL | 30.13 mm | 69.6 mm | 2.5 mm | 2190 | compliant | 5 | SODIMM-260 | |||||||||||||||||||||
IS43TR16128DL-107MBL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.35 V | 20 ns | 934.58 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | NO | YES | 4,8 | 16 mA | 1.283 V | 216 µA | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | e1 | 3 | 95 °C | 260 | 10 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 9 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.36 | 5.1 | BGA-96 | |||||||||
MT41K256M16TW-093:P
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | e1 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | 2190 | compliant | EAR99 | 8542.32.00.36 | 5.15 | FBGA-96 | ||||||||||||||||||||||
MT47H256M8EB-25E:C
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 2.1475 Gbit | 8 | 256MX8 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 12 mA | 250 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e1 | 85 °C | 260 | 30 | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.5 mm | 9 mm | 2190 | compliant | EAR99 | 8542.32.00.36 | 4.75 | 9 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | BGA | 60 | |||||||||
IS41LV16105D-50TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3.3 V | 25 ns | FAST PAGE | FAST PAGE DRAM | AUTO REFRESH; RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 20.95 mm | 10.16 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.02 | 4 | TSOP2-50/44 | 2016-03-31 | ||||||||||||||||||||||
MT40A2G16TBB-062E:F
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Active | 34.3597 Gbit | 16 | 2GX16 | 1.2 V | 1.6 GHz | 8192 | SINGLE BANK PAGE BURST | DDR4 DRAM | COMMON | 1 | 1 | 2000000000 | 2.1475 G | SYNCHRONOUS | YES | 76 mA | 400 µA | 1.26 V | 1.14 V | CMOS | R-PBGA-B96 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 7.5 mm | 2190 | compliant | 5 | FBGA-96 | |||||||||||||||||||||||
AS4C64M16D2A-25BCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | e1 | 3 | 85 °C | -40 °C | 265 | 20 | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.32 | 4 | FBGA-84 | ||||||||||||||||||||
IS43QR16256B-083RBLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 4.295 Gbit | 16 | 256MX16 | 1.2 V | 1.2005 GHz | 8192 | DUAL BANK PAGE BURST | DDR4 DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 8 | 58 mA | 1.14 V | 375 µA | 1.26 V | 1.14 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 95 °C | -40 °C | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13.5 mm | 7.5 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.36 | 5.1 | FBGA-96 | |||||||||||||||
MTA9ASF1G72PZ-3G2R1
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Active | DDR4 DRAM MODULE | 2190 | compliant | 0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AS4C8M32SA-6BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 32 | 8MX32 | 3.3 V | 5 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PBGA-B90 | 3 | 85 °C | -40 °C | 90 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 8 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 4 | FBGA-90 | 2016-11-16 | ||||||||||||||||||||||
IS45S16160J-6BLA1-TR
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | 166 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 4 mA | 100 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | 85 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 2070 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | 4 | BGA-54 | |||||||||||
AS4C32M16D1A-5TCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 2.5 V | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | 3 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | compliant | Taiwan | EAR99 | 8542.32.00.28 | 4 | 0.65 MM PITCH, HALOGEN AND LEAD FREE, TSOP2-66 |