型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 其他特性 | 破损率 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
|
JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
|
处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
|
封装形式
|
表面贴装
|
端子面层
|
端子形式
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端子节距
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端子位置
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宽度
|
长度 |
座面最大高度
|
mfrid
|
零件包装代码
|
包装说明
|
针数
|
是否符合REACH标准
|
HTS代码
|
Source Content uid
|
ECCN代码
|
YTEOL
|
|
BA6566FPT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||||
BA6566FPE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | POWER, HSOP-24 | 24 | unknown | |||||||||||||||
BA8206FE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CKT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | unknown | |||||||||||||||
BA6569AFPE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||||
BA6569AFP-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | compliant | 8542.39.00.01 | ||||||||||||||
LT1684CS
Analog Devices Inc
|
查询价格和库存 |
|
No | Active | 10 V | BIPOLAR | 1 | OTHER | TELEPHONE RINGER CIRCUIT | R-PDSO-G14 | e0 | Not Qualified | 1 | 125 °C | 14 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.649 mm | 1.752 mm | 1742 | SOP, | not_compliant | 8542.39.00.01 | LT1684CS | EAR99 | 8.5 | |||||||||||
BA6569AFP-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSOP-24 | 24 | compliant | 8542.39.00.01 | ||||||||||||||
BA6569AFPT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||||
BA6569AFPT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||||
LT1684IS
Analog Devices Inc
|
查询价格和库存 |
|
No | Active | 10 V | BIPOLAR | 1 | AUTOMOTIVE | TELEPHONE RINGER CIRCUIT | R-PDSO-G14 | e0 | Not Qualified | 1 | 125 °C | -40 °C | 14 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.649 mm | 1.752 mm | 1742 | SOP, | not_compliant | 8542.39.00.01 | LT1684IS | EAR99 | 8.5 | ||||||||||
BA6569AFP-E1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | BIPOLAR | 1 | 120 µA | OTHER | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 60 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | SOP32,.3,32 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, SOP32,.3,32 | 24 | compliant | 8542.39.00.01 | ||||||||
BA6569AFPE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | POWER, HSOP-24 | 24 | unknown | |||||||||||||||
BU8307CFT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1.1:1 | 1 | TELEPHONE DIALER CKT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | SOIC | SOP, | 24 | unknown | ||||||||||||||
BA8206F-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CIRCUIT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | compliant | 8542.39.00.01 | ||||||||||||||
BA8206FT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CKT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | unknown | |||||||||||||||
BU8307CF-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | TELEPHONE DIALER CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | SOIC | SOP, | 24 | compliant | 8542.39.00.01 | |||||||||||
BU8307CFT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1.1:1 | 1 | TELEPHONE DIALER CKT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | SOIC | SOP, | 24 | unknown | ||||||||||||||
BU8307CFE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1.1:1 | 1 | TELEPHONE DIALER CKT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | SOIC | SOP, | 24 | unknown | ||||||||||||||
BA8206FE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CKT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | unknown | |||||||||||||||
BA8206FT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CKT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | unknown |