电话电路封装型号_电话电路厂家价格-bom2buy

型号

型号						Most Relevant		Technical							Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	其他特性	晶体频率	破损率	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	YTEOL	Country Of Origin
TEA1062A NXP Semiconductors		查询价格和库存		Yes	Yes	Active	3.4 V	BIPOLAR				1	1.35 mA	COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16		Not Qualified		75 °C	-25 °C	245	40	16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO		THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	21.6 mm	4.7 mm	TEA1062A	2245	DIP	0.300 INCH, PLASTIC, SOT-38, DIP-16	16	compliant	8542.39.00.01	2
935083220118 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	2.7 V					1		COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDSO-G16	e4	Not Qualified	1	75 °C	-25 °C	NOT SPECIFIED	NOT SPECIFIED	16	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	1.27 mm	DUAL	3.9 mm	9.9 mm	1.75 mm	935083220118	2245	SOIC	PLASTIC, SOT-109, SO-16	16	compliant	8542.39.00.01
TEA1062 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	3.4 V	BIPOLAR				1	1.35 mA	COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16	e3	Not Qualified		75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	21.6 mm	4.7 mm	TEA1062	2245	DIP	0.300 INCH, PLASTIC, SOT-38, DIP-16	16	compliant	8542.39.00.01	2
PCD3332-1T NXP Semiconductors		查询价格和库存				Active			SELECTABLE MAKE/BREAK RATIO 2:1		3:2	1		OTHER	TELEPHONE MULTIFUNCTION CIRCUIT	R-PDSO-G28		Not Qualified		70 °C	-25 °C			28	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES		GULL WING	1.27 mm	DUAL	7.5 mm	17.9 mm	2.65 mm	PCD3332-1T	2245		SOP,		unknown	8542.39.00.01
BU8307CF-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	SELECTABLE MAKE/BREAK RATIO 1:2	3.58 MHz	1:1.5	1	1 µA	COMMERCIAL	TELEPHONE DIALER CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified		60 °C	-10 °C	260	10	24	PLASTIC/EPOXY	SOP	SOP24,.3	RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	15 mm	1.9 mm		2363	SOIC	SOP-24	24	compliant	8542.39.00.01	2
PCD3332-1T-T NXP Semiconductors		查询价格和库存				Active			SELECTABLE MAKE/BREAK RATIO 2:1		3:2	1		OTHER	TELEPHONE MULTIFUNCTION CIRCUIT	R-PDSO-G28	e4	Not Qualified		70 °C	-25 °C			28	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	7.5 mm	17.9 mm	2.65 mm	PCD3332-1T-T	2245	SOIC	SOP,	28	unknown	8542.39.00.01
BA8206F-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE RINGER CIRCUIT	R-PDSO-G8	e3/e2	Not Qualified				260	10	8	PLASTIC/EPOXY	LSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	5 mm	1.6 mm		2363	SOIC	SOP-8	8	compliant	8542.39.00.01
BA8206F-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	24 V	BIPOLAR				1	1.7 µA	OTHER	TELEPHONE RINGER CIRCUIT	R-PDSO-G8	e3/e2	Not Qualified		70 °C	-25 °C	260	10	8	PLASTIC/EPOXY	LSOP	SOP8,.25	RECTANGULAR	SMALL OUTLINE, LOW PROFILE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	5 mm	1.6 mm		2363	SOIC	LSOP, SOP8,.25	8	compliant	8542.39.00.01		Philippines
BU8307CF-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		SELECTABLE MAKE/BREAK RATIO 1:2		1:1.5	1			TELEPHONE DIALER CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified				260	10	24	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	15 mm	1.9 mm		2363	SOIC	SOP-24	24	compliant	8542.39.00.01
BA6566FT1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6566FT2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6569AFP-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active		BIPOLAR				1	120 µA	OTHER	TELEPHONE SPEECH CIRCUIT	R-PDSO-G26	e3/e2	Not Qualified		60 °C	-25 °C	260	10	26	PLASTIC/EPOXY	HSSOP	SOP32,.3,32	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP, SOP32,.3,32	24	compliant	8542.39.00.01
BA6566FP-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active		BIPOLAR				1	125 µA	OTHER	TELEPHONE SPEECH CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified		60 °C	-35 °C	260	10	24	PLASTIC/EPOXY	HSSOP	SOP32,.3,32	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSOP-24	24	compliant	8542.39.00.01
BA6566FE1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
TEA1062/C4/M1,112 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	2.7 V					1		COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16	e4	Not Qualified	1	75 °C	-25 °C	NOT SPECIFIED	NOT SPECIFIED	16	PLASTIC/EPOXY	DIP		RECTANGULAR	IN-LINE	NO	Nickel/Palladium/Gold (Ni/Pd/Au)	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	38.1 mm	4.32 mm	TEA1062/C4/M1,112	2245	DIP	DIP,	16	compliant	8542.39.00.01
BA6566F-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CIRCUIT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	compliant	8542.39.00.01
BA6566FPE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G26	e3/e2	Not Qualified				260	10	26	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	unknown
BA6566FPT1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G26	e3/e2	Not Qualified				260	10	26	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	unknown
BA6566FE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6566FP-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified				260	10	24	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	compliant	8542.39.00.01

型号						Most Relevant		Technical							Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	其他特性	晶体频率	破损率	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	YTEOL	Country Of Origin
TEA1062A NXP Semiconductors		查询价格和库存		Yes	Yes	Active	3.4 V	BIPOLAR				1	1.35 mA	COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16		Not Qualified		75 °C	-25 °C	245	40	16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO		THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	21.6 mm	4.7 mm	TEA1062A	2245	DIP	0.300 INCH, PLASTIC, SOT-38, DIP-16	16	compliant	8542.39.00.01	2
935083220118 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	2.7 V					1		COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDSO-G16	e4	Not Qualified	1	75 °C	-25 °C	NOT SPECIFIED	NOT SPECIFIED	16	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	1.27 mm	DUAL	3.9 mm	9.9 mm	1.75 mm	935083220118	2245	SOIC	PLASTIC, SOT-109, SO-16	16	compliant	8542.39.00.01
TEA1062 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	3.4 V	BIPOLAR				1	1.35 mA	COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16	e3	Not Qualified		75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	21.6 mm	4.7 mm	TEA1062	2245	DIP	0.300 INCH, PLASTIC, SOT-38, DIP-16	16	compliant	8542.39.00.01	2
PCD3332-1T NXP Semiconductors		查询价格和库存				Active			SELECTABLE MAKE/BREAK RATIO 2:1		3:2	1		OTHER	TELEPHONE MULTIFUNCTION CIRCUIT	R-PDSO-G28		Not Qualified		70 °C	-25 °C			28	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES		GULL WING	1.27 mm	DUAL	7.5 mm	17.9 mm	2.65 mm	PCD3332-1T	2245		SOP,		unknown	8542.39.00.01
BU8307CF-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	SELECTABLE MAKE/BREAK RATIO 1:2	3.58 MHz	1:1.5	1	1 µA	COMMERCIAL	TELEPHONE DIALER CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified		60 °C	-10 °C	260	10	24	PLASTIC/EPOXY	SOP	SOP24,.3	RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	15 mm	1.9 mm		2363	SOIC	SOP-24	24	compliant	8542.39.00.01	2
PCD3332-1T-T NXP Semiconductors		查询价格和库存				Active			SELECTABLE MAKE/BREAK RATIO 2:1		3:2	1		OTHER	TELEPHONE MULTIFUNCTION CIRCUIT	R-PDSO-G28	e4	Not Qualified		70 °C	-25 °C			28	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	7.5 mm	17.9 mm	2.65 mm	PCD3332-1T-T	2245	SOIC	SOP,	28	unknown	8542.39.00.01
BA8206F-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE RINGER CIRCUIT	R-PDSO-G8	e3/e2	Not Qualified				260	10	8	PLASTIC/EPOXY	LSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	5 mm	1.6 mm		2363	SOIC	SOP-8	8	compliant	8542.39.00.01
BA8206F-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	24 V	BIPOLAR				1	1.7 µA	OTHER	TELEPHONE RINGER CIRCUIT	R-PDSO-G8	e3/e2	Not Qualified		70 °C	-25 °C	260	10	8	PLASTIC/EPOXY	LSOP	SOP8,.25	RECTANGULAR	SMALL OUTLINE, LOW PROFILE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	5 mm	1.6 mm		2363	SOIC	LSOP, SOP8,.25	8	compliant	8542.39.00.01		Philippines
BU8307CF-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		SELECTABLE MAKE/BREAK RATIO 1:2		1:1.5	1			TELEPHONE DIALER CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified				260	10	24	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	15 mm	1.9 mm		2363	SOIC	SOP-24	24	compliant	8542.39.00.01
BA6566FT1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6566FT2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6569AFP-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active		BIPOLAR				1	120 µA	OTHER	TELEPHONE SPEECH CIRCUIT	R-PDSO-G26	e3/e2	Not Qualified		60 °C	-25 °C	260	10	26	PLASTIC/EPOXY	HSSOP	SOP32,.3,32	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP, SOP32,.3,32	24	compliant	8542.39.00.01
BA6566FP-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active		BIPOLAR				1	125 µA	OTHER	TELEPHONE SPEECH CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified		60 °C	-35 °C	260	10	24	PLASTIC/EPOXY	HSSOP	SOP32,.3,32	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSOP-24	24	compliant	8542.39.00.01
BA6566FE1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
TEA1062/C4/M1,112 NXP Semiconductors		查询价格和库存		Yes	Yes	Active	2.7 V					1		COMMERCIAL EXTENDED	TELEPHONE SPEECH CIRCUIT	R-PDIP-T16	e4	Not Qualified	1	75 °C	-25 °C	NOT SPECIFIED	NOT SPECIFIED	16	PLASTIC/EPOXY	DIP		RECTANGULAR	IN-LINE	NO	Nickel/Palladium/Gold (Ni/Pd/Au)	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	38.1 mm	4.32 mm	TEA1062/C4/M1,112	2245	DIP	DIP,	16	compliant	8542.39.00.01
BA6566F-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CIRCUIT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	compliant	8542.39.00.01
BA6566FPE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G26	e3/e2	Not Qualified				260	10	26	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	unknown
BA6566FPT1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G26	e3/e2	Not Qualified				260	10	26	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	unknown
BA6566FE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CKT	R-PDSO-G18	e3/e2	Not Qualified				260	10	18	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOIC	SOP,	18	unknown
BA6566FP-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active						1			TELEPHONE SPEECH CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified				260	10	24	PLASTIC/EPOXY	HSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	13.6 mm	2.11 mm		2363	SOIC	HSSOP,	24	compliant	8542.39.00.01

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