型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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BU8874F-DXT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
BU8874F-DX
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
BU8874-DX
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDIP-T8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN/TIN COPPER | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.3 mm | 4 mm | 2363 | DIP | DIP, | 8 | compliant | 8542.39.00.01 | ||||||
CMX683E4
CML Microcircuits Plc
|
查询价格和库存 |
|
Yes | Yes | Active | 3 V | 1 | 1.5 µA | INDUSTRIAL | TONE DECODER CIRCUIT | R-PDSO-G16 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | 4317157 | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | |||
BU8874F-DXE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
BU8871F-DX
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP-18 | 18 | compliant | 8542.39.00.01 | ||||||
BU8871F-DXT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
BU8871F-DXT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
BU8871F-DXE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP-18 | 18 | compliant | 8542.39.00.01 | ||||||
M-8870-01
IXYS Integrated Circuits Division
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 7 µA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDIP-T18 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 23.36 mm | 5.33 mm | 1854 | DIP | PLASTIC, DIP-18 | 18 | unknown | 8542.39.00.01 | ||||
BU8871F-DXE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||
ZL49030DDF1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 1 | 8 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2192 | SSOP | SSOP, SSOP20,.3 | 20 | compliant | 8542.39.00.01 | ||||||
ZL49030DCE1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 1 | 8 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2192 | SOIC | SOP, SOP18,.4 | 18 | compliant | 8542.39.00.01 | ||||||
ZL49030DCF1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 1 | 8 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2192 | SOIC | SOP, SOP18,.4 | 18 | compliant | 8542.39.00.01 | ||||||
ZL49030DDE1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 1 | 8 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2192 | SSOP | SSOP, SSOP20,.3 | 20 | compliant | 8542.39.00.01 | ||||||
MT8880CN1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | No | Transferred | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | 2192 | SSOP | 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 | 24 | unknown | 8542.39.00.01 | ||||
M-8870-01
Industrial Defender Inc
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 7 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317445 | DIP-18 | unknown | 8542.39.00.01 | ||||||||||
M-8870-02
IXYS Integrated Circuits Division
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 7 µA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDIP-T18 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 23.36 mm | 5.33 mm | 1854 | DIP | PLASTIC, DIP-18 | 18 | unknown | 8542.39.00.01 | ||||
MT8870DS-1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | No | Transferred | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 2192 | SOIC | SOP, SOP18,.4 | 18 | unknown | 8542.39.00.01 | |||||||
MT8870DC
Microsemi Corporation
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-GDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.99 mm | 5.08 mm | 2192 | DIP | CERDIP-18 | 18 | unknown | 8542.39.00.01 |