型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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YTEOL
|
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TA31136FN-TP1
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | TA31136FN-TP1 | 2484 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | 2 | |||||||
TA31136FN-TP2
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | TA31136FN-TP2 | 2484 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | 2 | |||||||
TA31136FN(EL)
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | TA31136FN(EL) | 2484 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | 2 | |||||||
TA31136FN(ER)
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | TA31136FN(ER) | 2484 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | 2 | |||||||
UA31136-P16-T
Unisonic Technologies Co Ltd
|
查询价格和库存 |
|
Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e0 | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | ||||||||||
UA31136-P16-R
Unisonic Technologies Co Ltd
|
查询价格和库存 |
|
Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e0 | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | ||||||||||
BU8241FS-E2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 1.9 mm | 2363 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | ||||
BU8241FS-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | SSOP | SSOP-24 | 24 | unknown | ||||||||||
BU8244F-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10 mm | 1.71 mm | 2363 | SOIC | SOP-16 | 16 | unknown | ||||||||||
BU8244F
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 16 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10 mm | 1.6 mm | 2363 | SOIC | SOP-16 | 16 | compliant | 8542.39.00.01 | ||||
BU8242F
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G20 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | 2363 | SOIC | SOP-20 | 20 | compliant | 8542.39.00.01 | ||||
BU8241FST2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | DUAL | 2363 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | |||||||||||
BU8241FSE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL EXTENDED | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | SSOP | SSOP, | 24 | unknown | ||||||
BU8241FST1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | DUAL | 2363 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | |||||||||||
BU8241FS-E1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | SSOP | SSOP, | 24 | compliant | ||||||||||
BU8241FSE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 1.9 mm | 2363 | SSOP | SSOP-24 | 24 | compliant | 8542.39.00.01 | |||||||
BU8241FS-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | SSOP | SSOP, | 24 | unknown | ||||||||||
UA31136G-P16-R
Unisonic Technologies Co Ltd
|
查询价格和库存 |
|
Yes | Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | TSSOP | HALOGEN FREE, TSSOP-16 | 16 | compliant | 8542.39.00.01 | |||||||||
BU8242FT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G20 | e3/e2 | Not Qualified | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | 2363 | SOIC | SOP-20 | 20 | compliant | 8542.39.00.01 | |||||||
UA31136G-P16-T
Unisonic Technologies Co Ltd
|
查询价格和库存 |
|
Yes | Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | TSSOP | TSSOP, | 16 | compliant | 8542.39.00.01 |