蜂窝电话电路封装型号_蜂窝电话电路厂家价格-bom2buy

型号

型号						Most Relevant					Technical					Compliance			Operating Conditions						Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	标称供电电压 (Vsup)	信道数量	数据速率	模拟集成电路 - 其他类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	COO	HTS代码	Date Of Intro	YTEOL	零件包装代码	针数	ECCN代码	Source Content uid	制造商包装代码	最大供电电压 (Vsup)	最小供电电压 (Vsup)
LLCC68IMLTRT Semtech Corporation		查询价格和库存			Yes	Active	3.3 V						1			RF AND BASEBAND CIRCUIT	S-XQCC-N24	e3		1	85 °C	-40 °C	260			24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	4 mm	4 mm	1 mm	2392	QFN-24	compliant	Malaysia	8542.39.00.01	2019-08-01	10
BGC100GN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active		CMOS					1			RF AND BASEBAND CIRCUIT	R-XBCC-B6			1						6	UNSPECIFIED	BCC		RECTANGULAR	CHIP CARRIER	YES		BUTT		BOTTOM				2065	TSNP-6	compliant		8542.39.00.01		9.1
MAX2606EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
LMV228TLX/NOPB Texas Instruments		查询价格和库存		Yes	Yes	Active	5 V			1			1	8 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-XBGA-B4	e1		1	85 °C	-40 °C	260		30	4	UNSPECIFIED	VFBGA		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL		BOTTOM				2477		compliant		8542.39.00.01		15			EAR99	LMV228TLX/NOPB
MAX2605EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
MAX2609EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
CC1101QRHBRG4Q1 Texas Instruments		查询价格和库存		Yes	Yes	Active	3 V				250 Mbps		1		AUTOMOTIVE	RF AND BASEBAND CIRCUIT	S-PQCC-N32	e4	Not Qualified	2	125 °C	-40 °C	260	AEC-Q100	30	32	PLASTIC/EPOXY	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	500 µm	QUAD	5 mm	5 mm	1 mm	2477	QFN-32	compliant	Malaysia	8542.39.00.01		15	QFN	32	5A991.B	CC1101QRHBRG4Q1
BALF-NRG-02D3 STMicroelectronics		查询价格和库存			Yes	Active							1			RF AND BASEBAND CIRCUIT	R-PBGA-B4	e1			105 °C	-40 °C	260		30	4	PLASTIC/EPOXY	VBGA	BGA4,2X2,40/16	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	1 mm	BOTTOM	855 µm	1.385 mm	690 µm	2443	CSPG-4	compliant	France			10				BALF-NRG-02D3
SX1268IMLTRT Semtech Corporation		查询价格和库存			Yes	Active	3.3 V						1			RF AND BASEBAND CIRCUIT	S-XQCC-N24	e3		1	85 °C	-40 °C	260			24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	4 mm	4 mm	1 mm	2392	QFN-24	compliant	Malaysia	8542.39.00.01		10
MAX2010ETI+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS					1	12.1 µA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260		30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm	2164	HVQCCN, LCC28,.2SQ,20	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	QFN	28	EAR99
LMH2110TMX/NOPB Texas Instruments		查询价格和库存		Yes	Yes	Active	4.5 V			1			1	5.5 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBGA-B6	e1		1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	VFBGA		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	400 µm	BOTTOM	840 µm	1.24 mm	675 µm	2477	DSBGA-6	compliant		8542.39.00.01		15	BGA	6	EAR99	LMH2110TMX/NOPB
LMH9226IRRLR Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			1			1	100 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PQCC-N12	e4		2	105 °C	-40 °C	260		30	12	PLASTIC/EPOXY	HVQCCN	LCC12,.08SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	NO LEAD	500 µm	QUAD	2 mm	2 mm	800 µm	2477	WQFN-12	compliant		8542.33.00.01	2019-12-22	15			EAR99	LMH9226IRRLR
LMH9126IRRLR Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			1			1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N12	e4		2	105 °C	-40 °C	260		30	12	PLASTIC/EPOXY	HQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG	YES	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	NO LEAD		QUAD				2477	WQFN-12	compliant		8542.33.00.01	2020-04-08	15			EAR99	LMH9126IRRLR
LTC5599IUF#PBF Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V	CMOS					1			RF AND BASEBAND CIRCUIT	S-PQCC-N24	e3		1			260			24	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	4 X 4 MM, LEAD FREE, PLASTIC, QFN-24	compliant	Malaysia	8542.39.00.01		8.5		24		LTC5599IUF#PBF	05-08-1697
LTC5584IUF#PBF Analog Devices Inc		查询价格和库存		No	Yes	Active	5 V	CMOS					1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PQCC-N24	e3		1	105 °C	-40 °C	260		30	24	PLASTIC/EPOXY	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-X, QFN-24	compliant	Malaysia			8.5		24		LTC5584IUF#PBF	05-08-1697
AD9361BBCZ-REEL Analog Devices Inc		查询价格和库存		No	Yes	Active												e1															Tin/Silver/Copper (Sn/Ag/Cu)							1742	CSPBGA-144	compliant	Singapore	8542.39.00.01		8.5	BGA	144	5A991.B	AD9361BBCZ-REEL	BC-144-7
STA8089FGB STMicroelectronics		查询价格和库存				Active	1.2 V	CMOS					1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N56	e3		3	85 °C	-40 °C	260		30	56	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	400 µm	QUAD	7 mm	7 mm	900 µm	2443	VFQFPN-56	compliant	Philippines	8542.39.00.01		9.2			7A994	STA8089FGB
ADF4360-7BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V			PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260		30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	LFCSP-24	compliant	South Korea	8542.39.00.01		8.5	QFN	24	EAR99	ADF4360-7BCPZ	CP-24-14	3.6 V	3 V
ST25R3918-AQET STMicroelectronics		查询价格和库存				Active	2.4 V						1	26 mA		RF AND BASEBAND CIRCUIT	S-XQCC-N32				105 °C	-40 °C				32	UNSPECIFIED	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	500 µm	QUAD	5 mm	5 mm	600 µm	2443	UFQFPN-32	unknown				10				ST25R3918-AQET
WFM200S022XNN3 Silicon Laboratories Inc		查询价格和库存			Yes	Active										TELECOM CIRCUIT				3			260		40															2406		unknown		8542.39.00.01	2020-09-23

型号						Most Relevant					Technical					Compliance			Operating Conditions						Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	标称供电电压 (Vsup)	信道数量	数据速率	模拟集成电路 - 其他类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	COO	HTS代码	Date Of Intro	YTEOL	零件包装代码	针数	ECCN代码	Source Content uid	制造商包装代码	最大供电电压 (Vsup)	最小供电电压 (Vsup)
LLCC68IMLTRT Semtech Corporation		查询价格和库存			Yes	Active	3.3 V						1			RF AND BASEBAND CIRCUIT	S-XQCC-N24	e3		1	85 °C	-40 °C	260			24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	4 mm	4 mm	1 mm	2392	QFN-24	compliant	Malaysia	8542.39.00.01	2019-08-01	10
BGC100GN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active		CMOS					1			RF AND BASEBAND CIRCUIT	R-XBCC-B6			1						6	UNSPECIFIED	BCC		RECTANGULAR	CHIP CARRIER	YES		BUTT		BOTTOM				2065	TSNP-6	compliant		8542.39.00.01		9.1
MAX2606EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
LMV228TLX/NOPB Texas Instruments		查询价格和库存		Yes	Yes	Active	5 V			1			1	8 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-XBGA-B4	e1		1	85 °C	-40 °C	260		30	4	UNSPECIFIED	VFBGA		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL		BOTTOM				2477		compliant		8542.39.00.01		15			EAR99	LMV228TLX/NOPB
MAX2605EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
MAX2609EUT+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V						1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G6	e3	Not Qualified	1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	950 µm	DUAL	1.625 mm	2.9 mm	1.45 mm	2164	ULTRA SMALL, SOT-23, 6 PIN	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	SOT-23	6	EAR99
CC1101QRHBRG4Q1 Texas Instruments		查询价格和库存		Yes	Yes	Active	3 V				250 Mbps		1		AUTOMOTIVE	RF AND BASEBAND CIRCUIT	S-PQCC-N32	e4	Not Qualified	2	125 °C	-40 °C	260	AEC-Q100	30	32	PLASTIC/EPOXY	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	500 µm	QUAD	5 mm	5 mm	1 mm	2477	QFN-32	compliant	Malaysia	8542.39.00.01		15	QFN	32	5A991.B	CC1101QRHBRG4Q1
BALF-NRG-02D3 STMicroelectronics		查询价格和库存			Yes	Active							1			RF AND BASEBAND CIRCUIT	R-PBGA-B4	e1			105 °C	-40 °C	260		30	4	PLASTIC/EPOXY	VBGA	BGA4,2X2,40/16	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	1 mm	BOTTOM	855 µm	1.385 mm	690 µm	2443	CSPG-4	compliant	France			10				BALF-NRG-02D3
SX1268IMLTRT Semtech Corporation		查询价格和库存			Yes	Active	3.3 V						1			RF AND BASEBAND CIRCUIT	S-XQCC-N24	e3		1	85 °C	-40 °C	260			24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	4 mm	4 mm	1 mm	2392	QFN-24	compliant	Malaysia	8542.39.00.01		10
MAX2010ETI+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS					1	12.1 µA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260		30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm	2164	HVQCCN, LCC28,.2SQ,20	compliant	Japan, Mainland China, Malaysia, Philipp... more	8542.39.00.01		9	QFN	28	EAR99
LMH2110TMX/NOPB Texas Instruments		查询价格和库存		Yes	Yes	Active	4.5 V			1			1	5.5 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBGA-B6	e1		1	85 °C	-40 °C	260		30	6	PLASTIC/EPOXY	VFBGA		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	400 µm	BOTTOM	840 µm	1.24 mm	675 µm	2477	DSBGA-6	compliant		8542.39.00.01		15	BGA	6	EAR99	LMH2110TMX/NOPB
LMH9226IRRLR Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			1			1	100 mA	INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PQCC-N12	e4		2	105 °C	-40 °C	260		30	12	PLASTIC/EPOXY	HVQCCN	LCC12,.08SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	NO LEAD	500 µm	QUAD	2 mm	2 mm	800 µm	2477	WQFN-12	compliant		8542.33.00.01	2019-12-22	15			EAR99	LMH9226IRRLR
LMH9126IRRLR Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			1			1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N12	e4		2	105 °C	-40 °C	260		30	12	PLASTIC/EPOXY	HQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG	YES	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	NO LEAD		QUAD				2477	WQFN-12	compliant		8542.33.00.01	2020-04-08	15			EAR99	LMH9126IRRLR
LTC5599IUF#PBF Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V	CMOS					1			RF AND BASEBAND CIRCUIT	S-PQCC-N24	e3		1			260			24	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	4 X 4 MM, LEAD FREE, PLASTIC, QFN-24	compliant	Malaysia	8542.39.00.01		8.5		24		LTC5599IUF#PBF	05-08-1697
LTC5584IUF#PBF Analog Devices Inc		查询价格和库存		No	Yes	Active	5 V	CMOS					1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PQCC-N24	e3		1	105 °C	-40 °C	260		30	24	PLASTIC/EPOXY	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-X, QFN-24	compliant	Malaysia			8.5		24		LTC5584IUF#PBF	05-08-1697
AD9361BBCZ-REEL Analog Devices Inc		查询价格和库存		No	Yes	Active												e1															Tin/Silver/Copper (Sn/Ag/Cu)							1742	CSPBGA-144	compliant	Singapore	8542.39.00.01		8.5	BGA	144	5A991.B	AD9361BBCZ-REEL	BC-144-7
STA8089FGB STMicroelectronics		查询价格和库存				Active	1.2 V	CMOS					1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N56	e3		3	85 °C	-40 °C	260		30	56	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	400 µm	QUAD	7 mm	7 mm	900 µm	2443	VFQFPN-56	compliant	Philippines	8542.39.00.01		9.2			7A994	STA8089FGB
ADF4360-7BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V			PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260		30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn)	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	1742	LFCSP-24	compliant	South Korea	8542.39.00.01		8.5	QFN	24	EAR99	ADF4360-7BCPZ	CP-24-14	3.6 V	3 V
ST25R3918-AQET STMicroelectronics		查询价格和库存				Active	2.4 V						1	26 mA		RF AND BASEBAND CIRCUIT	S-XQCC-N32				105 °C	-40 °C				32	UNSPECIFIED	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	500 µm	QUAD	5 mm	5 mm	600 µm	2443	UFQFPN-32	unknown				10				ST25R3918-AQET
WFM200S022XNN3 Silicon Laboratories Inc		查询价格和库存			Yes	Active										TELECOM CIRCUIT				3			260		40															2406		unknown		8542.39.00.01	2020-09-23

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