参考设计
(31)
Ethernet Powerlink Development Platform Reference Design
TIDEP0028: The TIDEP0028 Ethernet Powerlink development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Powerlink open media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Ethernet Powerlink slave communications, the TIDEP0028 allows designers to implement the real-time Powerlink communication standard for a broad range of industrial automation equipment. The design is based on the TMDSICE3359 Industrial Communications Engine (ICE).
Ethernet/IP Communications Development Platform
TIDEP0003: Targeted for Ethernet/IP slave communications, this development platform allows designers to mplement Ethernet/IP communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
TIDEP0032 Multi-Protocol Industrial Ethernet Detection w/PRU-ICSS for Industrial Automation Reference Design | TI.com
TIDEP0032: Industrial Ethernet for Industrial Automation exist in more than 30 industrial standards. Some of the well-established real-time Ethernet protocols, like EtherCAT, EtherNet/IP, PROFINET, Sercos III and PowerLink require dedicated MAC hardware support in terms of FPGA or ASICs. The Programmable Real-time Unit inside the Industrial Communication Subsystem (PRU-ICSS), which exists as HW block inside the Sitara processors family, replaces FPGA or ASICS by a single chip solution. A firmware in the PRU-ICSS allows detecting the type of Industrial Ethernet protocol and loading the appropriate industrial application during run-time into Sitara processor. This TI Design describes the multi-protocol Industrial Ethernet protocol detection firmware for PRU-ICSS.
TIDA-00271 ADAS Sensor Interconnect Reference Design Board for Remote Camera and Radar Modules | TI.com
TIDA-00271: The ADAS Sensor Interconnect Board is intended for applications where remote sensors like cameras, LIDAR or radar modules need to be connected to a central processing ECU. The board supports up to 3 coaxial and 1 LVDS twisted pair data inputs as well as 3 FMC cable and 1 board to board connector as data outputs to a processing ECU. Camera or other sensor modules connected through the coax connector (SMB standard) are powered directly via the coaxial cable (power over coax) from the interconnect board. Because of an independent complete power solution for all ICs and power over coax on board, a single car battery or similar wide voltage supply can be directly connected to the power connector on the ADAS Sensor Interconnect Board. An on-board uC and LIN interface allow control and configuration of the Interconnect board as well as plug-and-play operation.
TIDEP0008 PROFINET Communications Development Platform | TI.com
TIDEP0008: Targeted for PROFINET slave communications, this development platform allows designers to implement PROFINET communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
TIDEP0028 Ethernet Powerlink Development Platform Reference Design | TI.com
TIDEP0028: The TIDEP0028 Ethernet Powerlink development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Powerlink open media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Ethernet Powerlink slave communications, the TIDEP0028 allows designers to implement the real-time Powerlink communication standard for a broad range of industrial automation equipment. The design is based on the TMDSICE3359 Industrial Communications Engine (ICE).
Multi-Protocol Industrial Ethernet Detection w/PRU-ICSS for Industrial Automation Reference Design
TIDEP0032: Industrial Ethernet for Industrial Automation exist in more than 30 industrial standards. Some of the well-established real-time Ethernet protocols, like EtherCAT, EtherNet/IP, PROFINET, Sercos III and PowerLink require dedicated MAC hardware support in terms of FPGA or ASICs. The Programmable Real-time Unit inside the Industrial Communication Subsystem (PRU-ICSS), which exists as HW block inside the Sitara processors family, replaces FPGA or ASICS by a single chip solution. A firmware in the PRU-ICSS allows detecting the type of Industrial Ethernet protocol and loading the appropriate industrial application during run-time into Sitara processor. This TI Design describes the multi-protocol Industrial Ethernet protocol detection firmware for PRU-ICSS.
TIDEP0054 Parallel Redundancy Protocol (PRP) Ethernet Reference Design for Substation Automation | TI.com
TIDEP0054: This TI Design implements a solution for high-reliability, low-latency network communications for substation automation equipment in Smart Grid transmission and distribution networks. It supports the Parallel Redundancy Protocol (PRP) specification in the IEC 62439 standard using the PRU-ICSS. This solution is a lower-cost alternative to FPGA approaches and provides the flexibility and performance to add features such as IEC 61850 support without additional components.
TIDEP0050 EnDat 2.2 System Reference Design | TI.com
TIDEP0050: The TIDEP0050 TI Design implements the EnDat 2.2 Master protocol stack and hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of the EnDat 2.2 Master protocol stack, half-duplex communications using RS485 transceivers and the line termination implemented on the Sitara AM437x Industrial Development Kit. This design is fully tested to meet the HEIDENHAIN EnDat 2.2 standard. Along with EnDat position feedback, the AM437x IDK is also able to support industrial communications and motor drive as described in the AM437x Single-Chip Motor-Control Design Guide.
TIDEP0043 Acontis EtherCAT Master Stack Reference Design | TI.com
TIDEP0043: The acontis EC-Master EtherCAT Master stack is a highly portable software stack that can be used on various embedded platforms. The EC-Master supports the high performance TI Sitara MPUs, it provides a sophisticated EtherCAT Master solution which customers can use to implement EtherCAT communication interface boards, EtherCAT based PLC or motion control applications. The EC-Master architectural design does not require additional tasks to be scheduled, thus the full stack functionality is available even on an OS less platform such as TI Starterware suported on AM335x. Due to this architecture combined with the high speed Ethernet driver it is possible to implement EtherCAT master based applications on the Sitara platform with short cycle times of 100 microseconds or even below.
TIDEP0033 SPI Master with Signal Path Delay Compensation Reference Design | TI.com
TIDEP0033: The Programmable Real-time unit within the Industrial Communication Subsystem (PRU-ICSS) enables customers to support real-time critical applications without using FPGAs, CPLDs or ASICs. This TI design describes the implementation of the SPI master protocol with signal path delay compensation on PRU-ICSS. It supports the 32-bit communication protocol of ADS8688 with a SPI clock frequency of up to 16.7MHz.
EtherCAT Communications Development Platform
TIDEP0001: Targeted for EtherCAT slave communications, this development platform allows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
Sercos III Slave For AM437x Communication Development Platform Reference Design
TIDEP0039: The TIDEP0039 Sercos III Slave For AM437x Communication Development Platform Reference Design combines the AM437x Sitara processor family from Texas Instruments (TI) and the Sercos III media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Sercos III slave communications, the TIDEP0039 allows designers to implement the real-time Sercos III communication standard for a broad range of industrial automation equipment. The design is based on the TMDXIDK437X Industrial Development Kit (IDK).
PROFINET Communications Development Platform
TIDEP0008: Targeted for PROFINET slave communications, this development platform allows designers to implement PROFINET communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
TIDEP0025 Single Chip Drive for Industrial Communications and Motor Control | TI.com
TIDEP0025: This TI design implements a hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The platform also allows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables designers with a low foot print, low power and single chip solution in applications such as industrial automation, factory automation or industrial communication.
TIDEP0010 Sercos III Communications Development Platform | TI.com
TIDEP0010: The TIDEP0010 Sercos III communication development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Sercos III media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Sercos III slave communications, the TIDEP0010 allows designers to implement the real-time Sercos III communication standard for a broad range of industrial automation equipment. The design is based on the TMDSICE3359 Industrial Communications Engine (ICE).
Single Chip Drive for Industrial Communications and Motor Control
TIDEP0025: This TI design implements a hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The platform also allows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables designers with a low foot print, low power and single chip solution in applications such as industrial automation, factory automation or industrial communication.
TIDEP0001 EtherCAT Communications Development Platform | TI.com
TIDEP0001: Targeted for EtherCAT slave communications, this development platform allows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
SPI Master with Signal Path Delay Compensation Reference Design
TIDEP0033: The Programmable Real-time unit within the Industrial Communication Subsystem (PRU-ICSS) enables customers to support real-time critical applications without using FPGAs, CPLDs or ASICs. This TI design describes the implementation of the SPI master protocol with signal path delay compensation on PRU-ICSS. It supports the 32-bit communication protocol of ADS8688 with a SPI clock frequency of up to 16.7MHz.
EnDat 2.2 System Reference Design
TIDEP0050: The TIDEP0050 TI Design implements the EnDat 2.2 Master protocol stack and hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of the EnDat 2.2 Master protocol stack, half-duplex communications using RS485 transceivers and the line termination implemented on the Sitara AM437x Industrial Development Kit. This design is fully tested to meet the HEIDENHAIN EnDat 2.2 standard. Along with EnDat position feedback, the AM437x IDK is also able to support industrial communications and motor drive as described in the AM437x Single-Chip Motor-Control Design Guide.
TIDEP0039 Sercos III Slave For AM437x Communication Development Platform Reference Design | TI.com
TIDEP0039: The TIDEP0039 Sercos III Slave For AM437x Communication Development Platform Reference Design combines the AM437x Sitara processor family from Texas Instruments (TI) and the Sercos III media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Sercos III slave communications, the TIDEP0039 allows designers to implement the real-time Sercos III communication standard for a broad range of industrial automation equipment. The design is based on the TMDXIDK437X Industrial Development Kit (IDK).
TIDEP0003 Ethernet/IP Communications Development Platform | TI.com
TIDEP0003: Targeted for Ethernet/IP slave communications, this development platform allows designers to mplement Ethernet/IP communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
ADAS Sensor Interconnect Reference Design Board for Remote Camera and Radar Modules
TIDA-00271: The ADAS Sensor Interconnect Board is intended for applications where remote sensors like cameras, LIDAR or radar modules need to be connected to a central processing ECU. The board supports up to 3 coaxial and 1 LVDS twisted pair data inputs as well as 3 FMC cable and 1 board to board connector as data outputs to a processing ECU. Camera or other sensor modules connected through the coax connector (SMB standard) are powered directly via the coaxial cable (power over coax) from the interconnect board. Because of an independent complete power solution for all ICs and power over coax on board, a single car battery or similar wide voltage supply can be directly connected to the power connector on the ADAS Sensor Interconnect Board. An on-board uC and LIN interface allow control and configuration of the Interconnect board as well as plug-and-play operation.
Sercos III Communications Development Platform
TIDEP0010: The TIDEP0010 Sercos III communication development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Sercos III media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Sercos III slave communications, the TIDEP0010 allows designers to implement the real-time Sercos III communication standard for a broad range of industrial automation equipment. The design is based on the TMDSICE3359 Industrial Communications Engine (ICE).
Acontis EtherCAT Master Stack Reference Design
TIDEP0043: The acontis EC-Master EtherCAT Master stack is a highly portable software stack that can be used on various embedded platforms. The EC-Master supports the high performane TI Sitara MPUs, it provides a sophisticated EtherCAT Master solution which customers can use to implement EtherCAT communication interface boards, EtherCAT based PLC or motion control applications. The EC-Master architectural design does not require additional tasks to be scheduled, thus the full stack functionality is available even on an OS less platform such as TI Starterware suported on AM335x. Due to this architecture combined with the high speed Ethernet driver it is possible to implement EtherCAT master based applications on the Sitara platform with short cycle times of 100 microseconds or even below.
TIDEP0078 OPC UA Data Access Server for AM572x Reference Design | TI.com
TIDEP0078: OPC UA is an industrial machine-to-machine protocol designed to allow interoperability and communication between all machines connected under Industry 4.0. The TIDEP0078 TI Design demonstrates use of the MatrikonOPC™ OPC UA server development kit (SDK) to allow communications using an OPC UA data access (DA) server running embedded in a project or design. The OPC UA DA deals with real-time data and is best suited for industrial automation applications where time is an important aspect of the data. A reference OPC UA server implementation is provided that accesses the GPIO capabilities of the AM572x IDK. The reference code can be extended to provide an OPC UA interface to any data the AM572x IDK board can access including data acquired through Profibus, RS-485, CAN bus, and industrial Ethernet-based protocols such as EtherCAT™ or PROFINET™ using the Programmable Real-time Unit Industrial Communication Subsystems (PRU-ICSS).
