Source Content uid
STM32MP157FAC1
Brand Name
STMicroelectronics
Part Life Cycle Code
Active
Package Description
TFBGA-361
Reach Compliance Code
compliant
Factory Lead Time
13 weeks
Additional Feature
TERMPITCH-MAX
Clock Frequency-Max
64 MHz
External Data Bus Width
16
Number of DMA Channels
48
Operating Temperature-Max
105 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA361,23X23,25/20
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
1050 mA
Supply Voltage-Max
1.38 V
Supply Voltage-Nom
1.34 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC