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Memory > Flash Memories

S29GL256S90DHI010

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S29GL256S90DHI010
Added to BOM:

Infineon

Flash, 32MX8, 90ns, PBGA64, PACKAGE

Market Average:
-
Total Inventory:
-
Lifecycle Status: Transferred
7.7DanRisk Rank:DesignProductionLong Term
Technical Details
Price & Stock
Xrefs

Parametrics

Rohs Code
符合
Part Life Cycle Code
Transferred
Package Description
FBGA-64
Reach Compliance Code
compliant
ECCN Code
3A991.B.1.A
HTS Code
8542.32.00.51
Popularity
3127
Risk Rank
7.66
Access Time-Max
90 ns
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
S-PBGA-B64
JESD-609 Code
e1
Length
9 mm
Memory Density
268435456 bit
Memory IC Type
FLASH
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
256
Number of Terminals
64
Number of Words
16777216 words
Number of Words Code
16000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
16MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Page Size
16 words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
Sector Size
64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
Type
NOR TYPE
Width
9 mm
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