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Memory > Flash Memories

RC28F256P33TFE

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RC28F256P33TFE
Added to BOM:

Micron Technology

Flash, 16MX16, 95ns, PBGA64, BGA-64

Market Average:
-
Total Inventory:
-
Lifecycle Status: Obsolete
9.7DanRisk Rank:DesignProductionLong Term
Technical Details

Parametrics

Rohs Code
不符合
Part Life Cycle Code
Obsolete
Package Description
BGA-64
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Popularity
0
Risk Rank
9.73
Access Time-Max
95 ns
Additional Feature
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e0
Length
13 mm
Memory Density
268435456 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Sectors/Size
4,255
Number of Terminals
64
Number of Words
16777216 words
Number of Words Code
16000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
16MX16
Package Body Material
PLASTIC/EPOXY
Package Code
TBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
235
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Sector Size
16K,64K
Standby Current-Max
0.00021 A
Supply Current-Max
0.031 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
NO
Type
NOR TYPE
Width
10 mm
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