MB7122LM中文资料_PDF数据手册

MB7122LM

Add to BOM

IC,PROM,1KX4,TTL,DIP,18PIN,PLASTIC

Technical Details

Parametrics

Part Life Cycle Code

Obsolete

Package Description

DIP, DIP18,.3

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.71

Popularity

Risk Rank

9.49

Access Time-Max

60 ns

JESD-30 Code

R-PDIP-T18

JESD-609 Code

Memory Density

4096 bit

Memory IC Type

OTP ROM

Memory Width

Number of Functions

Number of Terminals

Number of Words

1024 words

Number of Words Code

1000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

70 °C

Operating Temperature-Min

0 °C

Organization

1KX4

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Parallel/Serial

PARALLEL

Qualification Status

Not Qualified

Supply Current-Max

0.05 mA

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

Technology

TTL

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

THROUGH-HOLE

Terminal Pitch

2.54 mm

Terminal Position

DUAL

ICP Business License 苏B2-20140176 苏ICP备14012660号-4
Copyright@Suzhou Lingdongzhenge Network Technology Co., Ltd.

苏公网安备 32059002001042号

Contact Us

US Headquarters

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

Suzhou Office

Zhongxin Building, No. 15 Moon Bay Road, Suzhou Industrial Park 4406-4411

Suzhou City, Jiangsu Province, 215021

Email：service@bom2buy.com

phone：(0512) 62988549

MB7122LM

Parametrics

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Suzhou Office

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MB7122LM

Parametrics

Help

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US Headquarters

Suzhou Office