Part Life Cycle Code
Active
Package Description
TFBGA,
Reach Compliance Code
compliant
Factory Lead Time
10 weeks
Memory Density
16777216 bit
Memory IC Type
STANDARD SRAM
Moisture Sensitivity Level
3
Number of Words
1048576 words
Number of Words Code
1000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
3 V
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)