HX6409DSFC中文资料_PDF数据手册

HX6409DSFC

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IC 4K X 9 OTHER FIFO, 30 ns, CQFP68, CERAMIC, QFP-68, FIFO

Technical Details

Parametrics

Source Content uid

HX6409DSFC

Part Life Cycle Code

Active

Package Description

QFF, QFP68,.99SQ,50

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.71

Popularity

Risk Rank

6.44

Access Time-Max

30 ns

Clock Frequency-Max (fCLK)

28 MHz

Cycle Time

34 ns

JESD-30 Code

S-CQFP-F68

Length

24.1808 mm

Memory Density

36864 bit

Memory IC Type

OTHER FIFO

Memory Width

Number of Functions

Number of Terminals

Number of Words

4096 words

Number of Words Code

4000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Organization

4KX9

Output Enable

YES

Package Body Material

Package Code

QFF

Package Equivalence Code

QFP68,.99SQ,50

Package Shape

SQUARE

Package Style

FLATPACK

Parallel/Serial

PARALLEL

Qualification Status

Not Qualified

Screening Level

38535V;38534K;883S

Seated Height-Max

2.2352 mm

Standby Current-Max

0.001 A

Supply Current-Max

0.28 mA

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

4.5 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

MILITARY

Terminal Form

FLAT

Terminal Pitch

1.27 mm

Terminal Position

QUAD

Width

24.1808 mm

ICP Business License 苏B2-20140176 苏ICP备14012660号-4
Copyright@Suzhou Lingdongzhenge Network Technology Co., Ltd.

苏公网安备 32059002001042号

Contact Us

US Headquarters

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

Suzhou Office

Zhongxin Building, No. 15 Moon Bay Road, Suzhou Industrial Park 4406-4411

Suzhou City, Jiangsu Province, 215021

Email：service@bom2buy.com

phone：(0512) 62988549

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