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首页 > 电子元器件选型 > 电容器 > 陶瓷电容器

GRM155R60J224KE01D

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GRM155R60J224KE01D
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muRata(村田)

Capacitor, Ceramic, Chip, General Purpose, 0.22uF, 6.3V, ±10%, X5R, 0402 (1005 mm), 0.020"T, -55º ~ +85ºC, 7" Reel/Paper Tape

市场均价:
¥0.0712
市场总库存:
1,257,641
生命周期状态: Active
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(7)
Low Noise High PSRR LDO Reference Design for Powering Hi-Fi Audio Application
TIDA-00571: The TIDA-00571 can provide very quiet output power for Hi-Fi audio application.
Wireless Thermocouple Sensor Transmitter DevPack for SensorTag Reference Design
TIDA-00650: The TIDA-00650 reference design shows how to build a wireless thermocouple based temperature transmitter. The design is in the DevPack form factor which can be used in combination with TIs SensorTag. This allows for the development of a wireless link with Bluetooth® Smart or other wireless technologies (Zigbee, WiFi, sub 1GHz). The 24-bit ∆Σ sensor front-end utilized in this design allows for operation over the -40 to +85C temperature range.
Thermocouple AFE Using RTD or Integrated Temperature Sensor for Cold Junction Compensation (CJC)
TIDA-00168: The sole objective of this reference design is to provide comprehensive details on how to design a simple, robust, and accurate analog front end (AFE) circuit for making precision temperature measurements with thermocouple sensors. TIDA-00168 explains the theory, operation, and complications involved in a step-by-step manner. Additionally, this reference design emphasizes topics like error analysis, the necessity of an anti-aliasing filter, biasing resistors for sensor diagnostics, CJC, linearization technique for sensor data, and the design challenges of printed circuit boards.
Optimized Latency, Power and Memory Footprint Thermocouple Sensing Front-end Reference Design
TIDA-00468: The TIDA-00468 Reference design shows how to build an isolated thermocouple sensing front-end with optimized power-consumption for loop powered application while: • reducing footprint from classical look-up table approach and • keeping the fast response time of linear piece wise interpolation
10.8Vin to 13.2Vin; 0.9Vout @ 30A; Non-Isolated Synchronous Buck Converter
PMP7996: A single-phase synchronous buck converter accepting an input voltage of 10.8Vin to 13.2Vin and providing an output of 0.9Vout capable of supplying 30A of output current.
Isolated Loop Powered Thermocouple Transmitter Reference Design
TIDA-00189: The Isolated Loop powered Thermocouple Transmitter reference design is a system solution providing precision K-type thermocouple measurements for 4 to 20-mA isolated current-loop applications. This design is intended as an evaluation module for users to fast prototype and develop end-products for process-control and factory-automation. Potential challenges with thermocouples as a temperature sensor include tiny voltage outputs, low sensitivity and nonlinearity; in addition, because in industrial environments ground potential differences higher than 100V are common, thermocouple and signal conditioning circuitry must be galvanically isolated. The design files include design considerations, block diagrams, schematics, Bill of Materials (BOM), layer plots, Altium files, Gerber Files, and MSP430 Firmware. Watch the TIDA-00349 Overview video, covering the same isolated power topology as used in the TIDA-00189 NOW
Small Form Factor, 2-Wire 4 to 20mA Current Loop RTD Temperature Transmitter Reference Design
TIDA-00165: This is a reference design for a robust, low power, precise and long-term stable 2-wire loop powered 4 to 20mA current output temperature transmitter. It uses RTD temperature sensor with 4 to 20mA current loop transmitter. It also explains sensor signal conditioning, ratiometric measurement technique, recommended software flow, calibration, sensor linearization, PCB layout and other practical design considerations. Furthermore, external protection circuitry is deployed in-place for compliance with regulatory IEC61000-4 standards – EFT, ESD and Surge requirements. EMC compliance to IEC61000-4 is necessary to ensure that the design not only survives but also performs as intended in the harsh/noisy industrial environment. All the relevant design files like Schematics, BOM, Layer plots, Altium files, Gerber and MSP430 MCU software have also been provided to the users.
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