Part Life Cycle Code
Transferred
Package Description
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100
Reach Compliance Code
compliant
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
Memory Density
2097152 bit
Memory IC Type
STANDARD SRAM
Moisture Sensitivity Level
3
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
0 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Standby Current-Max
0.04 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.225 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Temperature Grade
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
40