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Memory > SRAMs

71V67803S166BQ

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71V67803S166BQ
Added to BOM:

Renesas Electronics

3.3V 512K x 18 Synchronous 3.3V I/O PipeLined SRAM, CABGA136/Tray

Market Average：
-
Total Inventory：
-
Lifecycle Status： Obsolete
9DanRisk Rank:DesignProductionLong Term
Technical Details
Price & Stock

Parametrics

Source Content uid
71V67803S166BQ
Brand Name
Renesas
Pbfree Code
含铅
Rohs Code
不符合
Part Life Cycle Code
Obsolete
Part Package Code
CABGA
Pin Count
165
Manufacturer Package Code
BQ165
Reach Compliance Code
not_compliant
ECCN Code
NLR
HTS Code
8542320041
Popularity
2
Risk Rank
9
Access Time-Max
3.5 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
15 mm
Memory Density
9437184 bit
Memory IC Type
STANDARD SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
0 °C
Organization
512KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.05 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.34 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
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