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PROM:

70 个筛选结果
SRAM (542,744)
闪存 (317,688)
DRAM (267,290)
EEPROM (149,118)
FIFO (72,010)
OTP ROM (38,069)
EPROM (22,085)
MASK ROM (10,088)
PROM (70)
所有筛选条件
  • 所有筛选条件
  • 型号
  • 最长访问时间
  • 备用内存宽度
  • 启动块
  • 命令用户界面
  • 通用闪存接口
  • 数据轮询
  • 耐久性
  • I/O 类型
  • JESD-30 代码
  • JESD-609代码
  • 制造商
  • 内存密度
  • 内存集成电路类型
  • 内存宽度
  • 功能数量
  • 部门数/规模
  • 端子数量
  • 字数
  • 字数代码
  • 工作模式
  • 最高工作温度
  • 最低工作温度
  • 组织
  • 输出特性
  • 封装主体材料
  • 封装代码
  • 封装等效代码
  • 封装形状
  • 封装形式
  • 页面大小
  • 并行/串行
  • 生命周期
  • 是否无铅
  • 峰值回流温度(摄氏度)
型号 最长访问时间 (23)
354 200351 0762 1183 1594 200
-
制造商 (4)
内存密度 (14)
1 02416 777 2161 0244 195 0728 389 12012 583 16816 777 216
-
内存宽度 (3)
41647101316
-
321 048 57632262 168524 304786 4401 048 576
-
2561 000 000256250 192500 128750 0641 000 000
-
55125557390108125
-
-550-55-27-140
-
组织 (19)
型号
型号 Most Relevant Technical Compliance Operating Conditions Physical Other
数据手册 单价/库存
风险等级 是否无铅 是否Rohs认证
生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup)
最长访问时间 内存集成电路类型 备用内存宽度 I/O 类型 功能数量 字数代码 字数 工作模式 输出特性 并行/串行 最大待机电流
最大压摆率
最大供电电压 (Vsup)
最小供电电压 (Vsup)
技术 温度等级
JESD-30 代码 认证状态
JESD-609代码 最高工作温度 最低工作温度 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装
端子面层
端子形式
端子节距
端子位置
mfrid
包装说明
是否符合REACH标准
ECCN代码
HTS代码
YTEOL
MB7137HM-SK
FUJITSU Semiconductor Limited
查询价格和库存
危险
Obsolete 8.3886 Mbit 8 1MX8 5 V 120 ns OTP ROM 1 1000000 2.048 k ASYNCHRONOUS PARALLEL 180 µA TTL COMMERCIAL R-PDIP-T24 Not Qualified e0 70 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 4317229 DIP, DIP24,.3 unknown EAR99 8542.32.00.71 0
MB838200L-40PFTN
FUJITSU Semiconductor Limited
查询价格和库存
危险
Obsolete 8.3886 Mbit 16 512KX16 5 V 4.2 µs MASK ROM 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 10 µA 15 µA CMOS COMMERCIAL R-PDSO-G48 Not Qualified e0 70 °C 48 PLASTIC/EPOXY TSSOP TSSOP48,.71,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 4317229 TSSOP, TSSOP48,.71,20 unknown EAR99 8542.32.00.71 0
MB7132LCV-W
FUJITSU Semiconductor Limited
查询价格和库存
危险
Obsolete 16.384 kbit 8 2KX8 5 V 350 ns OTP ROM 1 2000 1.024 k ASYNCHRONOUS PARALLEL 60 µA TTL MILITARY S-XQCC-N28 Not Qualified e0 125 °C -55 °C 28 CERAMIC QCCN LCC28,.45SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 4317229 QCCN, LCC28,.45SQ unknown EAR99 8542.32.00.71 0
MCM2708L
Motorola Mobility LLC
查询价格和库存
危险
No No Obsolete 8.192 kbit 8 1KX8 450 ns 1000 1.024 k 3-STATE MOS COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.71 0
MCM7681PC
Motorola Mobility LLC
查询价格和库存
危险
No No Obsolete 8.192 kbit 8 1KX8 5 V 70 ns OTP ROM 1 1000 1.024 k ASYNCHRONOUS PARALLEL 150 µA 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-PDIP-T24 Not Qualified e0 75 °C 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.71 0
MCM7643ADC
Motorola Mobility LLC
查询价格和库存
危险
No No Obsolete 4.096 kbit 4 1KX4 5 V 50 ns OTP ROM 1 1000 1.024 k ASYNCHRONOUS PARALLEL 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-CDIP-T18 Not Qualified e0 75 °C 18 CERAMIC, METAL-SEALED COFIRED DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP18,.3 unknown EAR99 8542.32.00.71 0
MCM2532L
Motorola Mobility LLC
查询价格和库存
危险
No No Obsolete 32.768 kbit 8 4KX8 5 V 450 ns UVPROM COMMON 1 4000 4.096 k ASYNCHRONOUS 3-STATE PARALLEL 150 µA MOS COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.61 0
MB7123HM
FUJITSU Semiconductor Limited
查询价格和库存
危险
No No Obsolete e0 TIN LEAD 4317229 , unknown EAR99 8542.32.00.71 0
MCM7621DC
Motorola Mobility LLC
查询价格和库存
危险
No No Obsolete 2.048 kbit 4 512X4 5 V 70 ns OTP ROM 1 512 512 words ASYNCHRONOUS PARALLEL 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-CDIP-T16 Not Qualified e0 75 °C 16 CERAMIC, METAL-SEALED COFIRED DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP16,.3 unknown EAR99 8542.32.00.71 0
MBM27C128-25CV
FUJITSU Semiconductor Limited
查询价格和库存
危险
No No Obsolete 4317229 , unknown EAR99 8542.32.00.71 0
型号 Most Relevant Technical Compliance Operating Conditions Physical Other
数据手册 单价/库存
风险等级 是否无铅 是否Rohs认证
生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup)
最长访问时间 内存集成电路类型 备用内存宽度 I/O 类型 功能数量 字数代码 字数 工作模式 输出特性 并行/串行 最大待机电流
最大压摆率
最大供电电压 (Vsup)
最小供电电压 (Vsup)
技术 温度等级
JESD-30 代码 认证状态
JESD-609代码 最高工作温度 最低工作温度 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装
端子面层
端子形式
端子节距
端子位置
mfrid
包装说明
是否符合REACH标准
ECCN代码
HTS代码
YTEOL
MB7137HM-SK
FUJITSU Semiconductor Limited
查询价格和库存
Obsolete 8.3886 Mbit 8 1MX8 5 V 120 ns OTP ROM 1 1000000 2.048 k ASYNCHRONOUS PARALLEL 180 µA TTL COMMERCIAL R-PDIP-T24 Not Qualified e0 70 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 4317229 DIP, DIP24,.3 unknown EAR99 8542.32.00.71 0
MB838200L-40PFTN
FUJITSU Semiconductor Limited
查询价格和库存
Obsolete 8.3886 Mbit 16 512KX16 5 V 4.2 µs MASK ROM 8 1 512000 524.288 k ASYNCHRONOUS PARALLEL 10 µA 15 µA CMOS COMMERCIAL R-PDSO-G48 Not Qualified e0 70 °C 48 PLASTIC/EPOXY TSSOP TSSOP48,.71,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 4317229 TSSOP, TSSOP48,.71,20 unknown EAR99 8542.32.00.71 0
MB7132LCV-W
FUJITSU Semiconductor Limited
查询价格和库存
Obsolete 16.384 kbit 8 2KX8 5 V 350 ns OTP ROM 1 2000 1.024 k ASYNCHRONOUS PARALLEL 60 µA TTL MILITARY S-XQCC-N28 Not Qualified e0 125 °C -55 °C 28 CERAMIC QCCN LCC28,.45SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 4317229 QCCN, LCC28,.45SQ unknown EAR99 8542.32.00.71 0
MCM2708L
Motorola Mobility LLC
查询价格和库存
No No Obsolete 8.192 kbit 8 1KX8 450 ns 1000 1.024 k 3-STATE MOS COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.71 0
MCM7681PC
Motorola Mobility LLC
查询价格和库存
No No Obsolete 8.192 kbit 8 1KX8 5 V 70 ns OTP ROM 1 1000 1.024 k ASYNCHRONOUS PARALLEL 150 µA 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-PDIP-T24 Not Qualified e0 75 °C 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.71 0
MCM7643ADC
Motorola Mobility LLC
查询价格和库存
No No Obsolete 4.096 kbit 4 1KX4 5 V 50 ns OTP ROM 1 1000 1.024 k ASYNCHRONOUS PARALLEL 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-CDIP-T18 Not Qualified e0 75 °C 18 CERAMIC, METAL-SEALED COFIRED DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP18,.3 unknown EAR99 8542.32.00.71 0
MCM2532L
Motorola Mobility LLC
查询价格和库存
No No Obsolete 32.768 kbit 8 4KX8 5 V 450 ns UVPROM COMMON 1 4000 4.096 k ASYNCHRONOUS 3-STATE PARALLEL 150 µA MOS COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP24,.6 unknown EAR99 8542.32.00.61 0
MB7123HM
FUJITSU Semiconductor Limited
查询价格和库存
No No Obsolete e0 TIN LEAD 4317229 , unknown EAR99 8542.32.00.71 0
MCM7621DC
Motorola Mobility LLC
查询价格和库存
No No Obsolete 2.048 kbit 4 512X4 5 V 70 ns OTP ROM 1 512 512 words ASYNCHRONOUS PARALLEL 5.25 V 4.75 V CMOS COMMERCIAL EXTENDED R-CDIP-T16 Not Qualified e0 75 °C 16 CERAMIC, METAL-SEALED COFIRED DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 2141108 DIP, DIP16,.3 unknown EAR99 8542.32.00.71 0
MBM27C128-25CV
FUJITSU Semiconductor Limited
查询价格和库存
No No Obsolete 4317229 , unknown EAR99 8542.32.00.71 0
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