Parts | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Datasheet |
Price/Stock
|
Risk Rank | Pbfree Code |
Rohs Code
|
Part Life Cycle Code | Memory Density | Memory Width |
Sector Size
|
Organization |
Supply Voltage-Nom (Vsup)
|
Access Time-Max | Clock Frequency-Max (fCLK) | Memory IC Type | Additional Feature | Alternate Memory Width | Command User Interface | Common Flash Interface | Data Polling | Data Retention Time-Min | Endurance | I2C Control Byte | Number of Functions | Number of Ports | Number of Sectors/Size | Number of Words Code | Number of Words | Operating Mode | Output Characteristics | Page Size | Parallel/Serial |
Programming Voltage
|
Ready/Busy
|
Reverse Pinout
|
Serial Bus Type
|
Standby Current-Max
|
Supply Current-Max
|
Supply Voltage-Max (Vsup)
|
Supply Voltage-Min (Vsup)
|
Technology |
Temperature Grade
|
Toggle Bit
|
Type
|
Write Cycle Time-Max (tWC)
|
Write Protection
|
JESD-30 Code |
Qualification Status
|
JESD-609 Code | Moisture Sensitivity Level | Operating Temperature-Max | Operating Temperature-Min | Peak Reflow Temperature (Cel) |
Screening Level
|
Time@Peak Reflow Temperature-Max (s)
|
Number of Terminals | Package Body Material | Package Code | Package Equivalence Code | Package Shape | Package Style |
Surface Mount
|
Terminal Finish
|
Terminal Form
|
Terminal Pitch
|
Terminal Position
|
Seated Height-Max
|
Length |
Width
|
mfrid
|
Package Description
|
Reach Compliance Code
|
Country Of Origin
|
YTEOL
|
Source Content uid
|
Part Package Code
|
Pin Count
|
ECCN Code
|
HTS Code
|
Manufacturer Package Code
|
Date Of Intro
|
||
S25FL512SAGMFI011
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 512.7537 Mbit | 8 | 64MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 64.0942 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | SOIC-16 | compliant | Mainland China, Taiwan | 9.8 | ||||||||||||||||||||||||||
S29GL01GS11DHIV13
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 1.0737 Gbit | 16 | 64K | 64MX16 | 3 V | 110 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 1024 | 64000000 | 67.1089 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | 2065 | FBGA-64 | compliant | 9.8 | |||||||||||||||||||||||
24C02CT/SN
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | 5 V | I2C | 50 µA | 3 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | 1 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | compliant | Thailand | 9 | 24C02CT/SN | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||
M95512-RDW6TP
STMicroelectronics
|
Query price and inventory |
|
Yes | Active | 524.288 kbit | 8 | 64KX8 | 2.5 V | 5 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | SPI | 5 µA | 8 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2443 | 0.169 INCH, ROHS COMPLIANT, TSSOP-8 | compliant | Mainland China | 9 | M95512-RDW6TP | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
S25FL064LABMFI010
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | Mainland China, Taiwan | 6.8 | |||||||||||||||||||||||||||||||||||
S25FL064LABMFV013
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | 6.8 | |||||||||||||||||||||||||||||||||||||
93AA56AT-I/OT
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 1 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 256 | 256 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | 2188 | compliant | Thailand | 9 | 93AA56AT-I/OT | SOT-23 | 6 | EAR99 | 8542.32.00.51 | ||||||||||||||||||
S25FL064LABMFI013
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | 2 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | Mainland China, Taiwan | 6.8 | ||||||||||||||||||||||||||||||
24LC025-I/ST
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | compliant | Thailand | 9 | 24LC025-I/ST | SOIC | 8 | EAR99 | 8542.32.00.51 | ||||||||||||||||||
S29GL01GS11FHIV10
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 1.0737 Gbit | 16 | 64K | 64MX16 | 3 V | 110 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 1024 | 64000000 | 67.1089 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | R-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | 2065 | FBGA-64 | compliant | 9.8 | |||||||||||||||||||||||
DS2401A+
Analog Devices Inc
|
Query price and inventory |
|
Yes | Active | MEMORY CIRCUIT | e3 | 250 | Matte Tin (Sn) | 1742 | compliant | Japan, Mainland China, Malaysia, Philipp... more | 8.5 | DS2401A+ | 3-TO92-N/A | 3 | 3-TO92-N/A | 2002-02-22 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
M95512-DRMN3TP/K
STMicroelectronics
|
Query price and inventory |
|
Yes | Active | 524.288 kbit | 8 | 64KX8 | 5 V | 5 MHz | EEPROM | 40 | 4000000 Write/Erase Cycles | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | SPI | 1 µA | 5 µA | 5.5 V | 1.8 V | CMOS | AUTOMOTIVE | 4 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2443 | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SON-8 | compliant | Mainland China | 9 | M95512-DRMN3TP/K | SON | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
M95512-DRDW3TP/K
STMicroelectronics
|
Query price and inventory |
|
Yes | Active | 524.288 kbit | 8 | 64KX8 | 5 V | 5 MHz | EEPROM | 40 | 4000000 Write/Erase Cycles | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | SPI | 1 µA | 5 µA | 5.5 V | 1.8 V | CMOS | AUTOMOTIVE | 4 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2443 | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | compliant | Mainland China | 9 | M95512-DRDW3TP/K | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
CAT25256YI-GT3
onsemi
|
Query price and inventory |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 5 MHz | EEPROM | 100 YEAR DATA RETENTION | 100 | 1000000 Write/Erase Cycles | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | SPI | 1 µA | 4 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2260 | compliant | Thailand | 6 | CAT25256YI-GT3 | TSSOP8, 4.4x3 | 8 | EAR99 | 8542.32.00.51 | 948AL | |||||||||||||||||||||
24C65/P
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 8000 | 8.192 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 5 µA | 3 µA | 6 V | 4.5 V | CMOS | COMMERCIAL | 5 ms | R-PDIP-T8 | Not Qualified | e3 | 70 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 9.46 mm | 7.62 mm | 2188 | 0.300 INCH, PLASTIC, MS-001, DIP-8 | compliant | Thailand | 9 | 24C65/P | DIP | 8 | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||
24LC512-E/SM
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 524.288 kbit | 8 | 64KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | I2C | 5 µA | 5 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.245 mm | 5.23 mm | 2188 | 5.28 MM, PLASTIC, ROHS COMPLIANT, EIAJ, SOIJ-8 | compliant | Thailand | 10.46 | 24LC512-E/SM | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
24LC512-I/SM
Microchip Technology Inc
|
Query price and inventory |
|
Yes | Yes | Active | 524.288 kbit | 8 | 64KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 5 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.245 mm | 5.23 mm | 2188 | 5.28 MM, PLASTIC, ROHS COMPLIANT, EIAJ, SOIJ-8 | compliant | Thailand | 10.46 | 24LC512-I/SM | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
S29GL128S10DHIV10
Infineon Technologies AG
|
Query price and inventory |
|
Yes | Active | 134.2177 Mbit | 16 | 64K | 8MX16 | 3 V | 100 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 128 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | 2065 | FBGA-64 | compliant | 9.8 | |||||||||||||||||||||||
M95512-RMN6TP
STMicroelectronics
|
Query price and inventory |
|
Yes | Active | 524.288 kbit | 8 | 64KX8 | 2.5 V | 5 MHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1 | 64000 | 65.536 k | SYNCHRONOUS | SERIAL | SPI | 5 µA | 8 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2443 | 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | compliant | Philippines | 9 | M95512-RMN6TP | SOIC | 8 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
BR24G16FVT-3AGE2
ROHM Semiconductor
|
Query price and inventory |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 kHz | EEPROM | 1.7V AT 1MHZ | 1 | 2000 | 2.048 k | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2363 | 3 X 6.40 MM, 1.20 MM HEIGHT, HALOGEN FREE, TSSOP-8 | compliant | Philippines | 5.8 | EAR99 | 8542.32.00.51 |