型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 |
部门规模
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组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 启动块 | 命令用户界面 | 通用闪存接口 | 数据轮询 | 数据保留时间-最小值 | 耐久性 | 功能数量 | 端口数量 | 部门数/规模 | 字数代码 | 字数 | 工作模式 | 输出特性 | 页面大小 | 并行/串行 |
编程电压
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就绪/忙碌
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串行总线类型
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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切换位
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类型
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最长写入周期时间 (tWC)
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写保护
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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Source Content uid
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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Country Of Origin
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ECCN代码
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HTS代码
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YTEOL
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SST39VF1601C-70-4C-B3KE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SST39VF1601C-70-4C-B3KE | 2188 | BGA | TFBGA-48 | 48 | compliant | Philippines, Taiwan, Thailand | 3A991.B.1.A | 8542.32.00.51 | 10.29 | |||||||||
SST39VF1601C-70-4I-EKE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SST39VF1601C-70-4I-EKE | 2188 | TSOP1 | TSOP-48 | 48 | compliant | Thailand | EAR99 | 8542.32.00.51 | 10.29 | ||||||||
MX29LV800CBTI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin (Sn) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | 4307504 | TSOP | TFBGA, TSSOP48,.8,20 | 48 | unknown | Taiwan | 3A991.B.1.A | 8542.32.00.51 | 5 | ||||||||||||||
S25FL128SAGMFI003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | compliant | Mainland China, Taiwan, Thailand | 9.8 | ||||||||||||||||||||
MX29F040CQI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 14.05 mm | 11.43 mm | 4307504 | LCC | ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | 32 | compliant | Taiwan | 3A991.B.1.A | 8542.32.00.51 | 3.15 | |||||||||||||||||
S25FL128SAGNFI003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | 9.8 | ||||||||||||||||||||||
S25FL064LABMFI010
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | Mainland China, Taiwan | 6.8 | ||||||||||||||||||||||||||||||||
S25FL064LABMFV013
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | 6.8 | ||||||||||||||||||||||||||||||||||
S29GL01GS11FHIV10
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1.0737 Gbit | 16 | 64K | 64MX16 | 3 V | 110 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 1024 | 64000000 | 67.1089 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | R-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | 2065 | compliant | 9.8 | |||||||||||||||||||||
S25FL128SAGNFV001
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | 9.8 | ||||||||||||||||||||||
S25FL128SAGNFI000
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | Taiwan, Thailand | 9.8 | |||||||||||||||||||||
S29GL512S11DHIV23
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 64K | 32MX16 | 3 V | 110 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 512 | 32000000 | 33.5544 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | 2065 | compliant | 9.8 | |||||||||||||||||||||
S29GL128S10DHIV10
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 16 | 64K | 8MX16 | 3 V | 100 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 128 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | 2065 | compliant | 9.8 | |||||||||||||||||||||
S29GL01GS11DHIV13
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1.0737 Gbit | 16 | 64K | 64MX16 | 3 V | 110 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 1024 | 64000000 | 67.1089 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | 2065 | compliant | 9.8 | |||||||||||||||||||||
S25FL128SAGNFV003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | 9.8 | ||||||||||||||||||||||
S25FL064LABMFM010
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | S-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | 6.8 | |||||||||||||||||||||||||||||||||
S25FL512SAGMFI011
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 512.7537 Mbit | 8 | 64MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 64.0942 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | SOIC-16 | compliant | Mainland China, Taiwan | 9.8 | |||||||||||||||||||||||
S25FL064LABMFI013
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | 2 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | Mainland China, Taiwan | 6.8 | |||||||||||||||||||||||||||
S25FL512SAGMFV010
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 512.7537 Mbit | 8 | 64MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 64.0942 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | SOIC-16 | compliant | 9.8 | ||||||||||||||||||||||||
S25FL064LABMFB013
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 105 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | compliant | 6.8 |