Parts | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet |
Price/Stock
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Risk Rank | Pbfree Code |
Rohs Code
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Part Life Cycle Code | Memory Density | Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max | Clock Frequency-Max (fCLK) | Cycle Time | Memory IC Type | Additional Feature | Alternate Memory Width | Number of Functions | Number of Words Code | Number of Words | Operating Mode | Output Characteristics | Output Enable | Parallel/Serial |
Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code |
Qualification Status
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JESD-609 Code | Moisture Sensitivity Level | Operating Temperature-Max | Operating Temperature-Min | Peak Reflow Temperature (Cel) |
Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals | Package Body Material | Package Code | Package Equivalence Code | Package Shape | Package Style |
Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length |
Width
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Source Content uid
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mfrid
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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Country Of Origin
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ECCN Code
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HTS Code
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YTEOL
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Manufacturer Package Code
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Date Of Intro
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CD74HCT40105M
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 64 bit | 4 | 16X4 | 5 V | 2.25 µs | 10 MHz | 100 ns | OTHER FIFO | 1 | 16 | 16 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 9.9 mm | 3.9 mm | CD74HCT40105M | 2477 | SOIC | SOIC-16 | 16 | compliant | Mexico | EAR99 | 8542.39.00.01 | 15 | ||||||||
SN74V245-7PAG
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 73.728 kbit | 18 | 4KX18 | 3.3 V | 5 ns | 166 MHz | 7.5 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 35 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e4 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 10 mm | 10 mm | SN74V245-7PAG | 2477 | QFP | GREEN, PLASTIC, TQFP-64 | 64 | compliant | Taiwan | EAR99 | 8542.32.00.71 | 15 | ||||||||
SN74ACT7813-15DL
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 1.152 kbit | 18 | 64X18 | 5 V | 12 ns | 67 MHz | 15 ns | OTHER FIFO | 1 | 64 | 64 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 400 µA | 400 nA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e4 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | SSOP | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 635 µm | DUAL | 2.79 mm | 18.415 mm | 7.5 mm | SN74ACT7813-15DL | 2477 | SSOP | 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-56 | 56 | compliant | Malaysia | EAR99 | 8542.39.00.01 | 15 | |||||||
72221L15JGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 10 ns | 15 ns | OTHER FIFO | 1 | 1000 | 1.024 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 5 mA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PLCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | RECTANGULAR | YES | Matte Tin (Sn) - annealed | J BEND | QUAD | 72221L15JGI | 2068 | PLCC | LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | PLG32 | 1992-01-01 | ||||||||||||||
SN74V235-7PAG
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 36.864 kbit | 18 | 2KX18 | 3.3 V | 5 ns | 166 MHz | 7.5 ns | OTHER FIFO | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 35 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e4 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 10 mm | 10 mm | SN74V235-7PAG | 2477 | QFP | GREEN, PLASTIC, TQFP-64 | 64 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 15 | ||||||||
72V255LA15TFGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 147.456 kbit | 18 | 8KX18 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 55 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 72V255LA15TFGI | 2068 | TQFP | GREEN, SLIM, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 | PPG64 | 1994-01-01 | |||||||
SN74ALVC7804-25DL
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 9.216 kbit | 18 | 512X18 | 3.3 V | 22 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 512 | 512 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 40 nA | 3.6 V | 3.3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e4 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | SSOP | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 635 µm | DUAL | 2.79 mm | 18.415 mm | 7.5 mm | SN74ALVC7804-25DL | 2477 | SSOP | 0.300 INCH, MO-118, SSOP-56 | 56 | compliant | Malaysia | EAR99 | 8542.39.00.01 | 15 | ||||||||
7281L15PAGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 4.608 kbit | 9 | 512X9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 15 mA | 125 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | 7281L15PAGI | 2068 | TSSOP | TSSOP-56 | 56 | compliant | EAR99 | 8542.32.00.71 | PAG56 | |||||||
72V2113L6PFG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 4 ns | 166 MHz | 6 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V2113L6PFG | 2068 | TQFP | TQFP-80 | 80 | compliant | EAR99 | 8542.32.00.71 | PNG80 | 1998-11-01 | ||||||
7204L12SOG
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | e3 | 3 | 260 | 30 | Matte Tin (Sn) | 7204L12SOG | 2068 | SOIC | 28 | compliant | EAR99 | 8542.32.00.71 | PEG28 | ||||||||||||||||||||||||||||||||||||||||||||||
SN74V245-15PAGEP
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 73.728 kbit | 18 | 4KX18 | 3.3 V | 11 ns | 66.7 MHz | 16 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 35 µA | 3.6 V | 3 V | CMOS | MILITARY | S-PQFP-G64 | e4 | 3 | 125 °C | -55 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 10 mm | 10 mm | SN74V245-15PAGEP | 2477 | TQFP-64 | compliant | Taiwan | EAR99 | 8542.32.00.71 | 15 | ||||||||||
72V2113L7-5BCI
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | 72V2113L7-5BCI | 2068 | CABGA | 11 X 11 MM, 1 MM PITCH, BGA-100 | 100 | not_compliant | EAR99 | 8542.32.00.71 | BC100 | 1998-11-01 | |||||
SN74V3690-6PEU
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 1.1796 Mbit | 36 | 32KX36 | 3.3 V | 4.5 ns | 1 MHz | 6 ns | OTHER FIFO | 18 | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 40 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | R-PQFP-G128 | Not Qualified | e4 | 3 | 70 °C | 220 | 20 | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.6 mm | 20 mm | 14 mm | SN74V3690-6PEU | 2477 | QFP | PLASTIC, LQFP-128 | 128 | compliant | Taiwan | EAR99 | 8542.32.00.71 | 15 | |||||||
SN74V245-15PAG
Texas Instruments
|
Query price and inventory |
|
Yes | Yes | Active | 73.728 kbit | 18 | 4KX18 | 3.3 V | 10 ns | 166 MHz | 15 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 35 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e4 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 10 mm | 10 mm | SN74V245-15PAG | 2477 | QFP | GREEN, PLASTIC, TQFP-64 | 64 | compliant | Taiwan | EAR99 | 8542.32.00.71 | 15 | ||||||||
72V2113L7-5BC
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | 72V2113L7-5BC | 2068 | CABGA | 11 X 11 MM, 1 MM PITCH, BGA-100 | 100 | not_compliant | EAR99 | 8542.32.00.71 | BC100 | 1998-11-01 | ||||||
72V36110L6BB
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 4 ns | 166 MHz | 6 ns | OTHER FIFO | RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 40 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B144 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 13 mm | 13 mm | 72V36110L6BB | 2068 | PBGA | 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 | 144 | not_compliant | EAR99 | 8542.32.00.71 | BB144 | 1998-10-01 | |||||||
7201LA50DB
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.608 kbit | 9 | 512X9 | 5 V | 50 ns | 15 MHz | 65 ns | OTHER FIFO | RETRANSMIT | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 900 µA | 100 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 37.211 mm | 15.24 mm | 7201LA50DB | 2068 | CDIP | 0.600 INCH, CERAMIC, DIP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | CD28 | 1988-01-01 | ||||||
7201LA20LB
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 4.608 kbit | 9 | 512X9 | 5 V | 20 ns | 33.33 MHz | 30 ns | OTHER FIFO | RETRANSMIT | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 900 µA | 140 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | 7201LA20LB | 2068 | LCC | LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | LC32 | 1988-01-01 | ||||||
7204L30TDB
Integrated Device Technology Inc
|
Query price and inventory |
|
No | No | Transferred | 36.864 kbit | 9 | 4KX9 | 5 V | 30 ns | 25 MHz | 40 ns | OTHER FIFO | RETRANSMIT | 1 | 4000 | 4.096 k | ASYNCHRONOUS | NO | PARALLEL | 4 mA | 150 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-STD-883 Class B | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 37.1475 mm | 7.62 mm | 7204L30TDB | 2068 | CDIP | CERAMIC, DIP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | SD28 | 1988-01-01 | ||||||
7285L15PAGI
Integrated Device Technology Inc
|
Query price and inventory |
|
Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 15 mA | 150 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | 7285L15PAGI | 2068 | TSSOP | TSSOP-56 | 56 | compliant | EAR99 | 8542.32.00.71 | PAG56 |