总线控制器封装型号_总线控制器厂家价格-bom2buy

型号

型号				Most Relevant						Technical					Compliance		Operating Conditions			Physical								Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	总线兼容性	外部数据总线宽度	地址总线宽度	最大时钟频率	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	最高工作温度	最低工作温度	筛选级别	端子数量	封装主体材料	封装代码	封装形状	封装形式	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL
TSPC106AMGSU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGU/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSU66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSU66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGS66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45

型号				Most Relevant						Technical					Compliance		Operating Conditions			Physical								Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	总线兼容性	外部数据总线宽度	地址总线宽度	最大时钟频率	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	最高工作温度	最低工作温度	筛选级别	端子数量	封装主体材料	封装代码	封装形状	封装形式	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL
TSPC106AMGSU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGU/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-B303	Not Qualified	110 °C	-40 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSU66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/Q66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGSU66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGB/T66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C	MIL-STD-883	303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AVGSB/Q66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V		R-CBGA-X303	Not Qualified	110 °C	-40 °C	MIL-STD-883 Class B	303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGU/T66CG Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-B303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	BGA	RECTANGULAR	GRID ARRAY	BALL	1.27 mm	BOTTOM	3.16 mm	21 mm	25 mm	1937079	BGA	BGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45
TSPC106AMGS66CE Teledyne e2v		查询价格和库存		Active	60X; POWERPC 601; POWERPC 603; POWERPC 604	64	32	66 MHz	YES	3.3 V	BUS CONTROLLER, PCI	CMOS	3.465 V	3.135 V	MILITARY	R-CBGA-X303	Not Qualified	125 °C	-55 °C		303	CERAMIC, METAL-SEALED COFIRED	CGA	RECTANGULAR	GRID ARRAY	UNSPECIFIED	1.27 mm	BOTTOM	3.84 mm	21 mm	25 mm	1937079	CGA	CGA,	303	compliant	3A991.A.2	8542.31.00.01	5.45

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